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參數(shù)資料
| 型號： | μPD70P083 |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機(jī)微控制器（8位單片微控制器） |
| 文件頁數(shù)： | 49/56頁 |
| 文件大小： | 390K |
| 代理商： | ΜPD70P083 |
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49
m
PD78P083
10. RECOMMENDED SOLDERING CONDITIONS
It is recommended that the μPD78P083 be soldered under the following conditions.
For details on the recommended soldering conditions, refer to information document
"Semiconductor Device Mounting
Technology Manual" (C10535E)
.
For soldering methods and conditions other than those recommended, please contact your NEC sales representative.
Table 10-1. Soldering Conditions for Surface Mount Types
μ
PD78P083GB-3B4
μ
PD78P083GB-3BS-MTX : 44-pin plastic QFP (10
x
10 mm)
: 44-pin plastic QFP (10
x
10 mm)
Caution Do not use different soldering methods together (except for partial heating method).
Table 10-2. Soldering Condition for Hole-Through Types
μ
PD78P083CU : 42-pin plastic shrink DIP (600 mil)
μ
PD78P083DU : 42-pin ceramic shrink DIP (with window) (600 mil)
Soldering Method
Soldering Conditions
Wave Soldering
(only pins)
Solder temperature: 260°C or below, Flow time: 10 seconds or less
Partial heating
Pin temperature: 300°C or below, Flow time: 3 seconds or less (per pin)
Soldering Method
Infrared ray reflow
Soldering Conditions
Symbol
Package peak temperature: 235
°
C, Reflow time: 30 seconds or
less (at 210
°
C or higher), Number of reflow processes: 2 or less
< Cautions >
(1) Wait for the device temperature to return to normal after the
first reflow before starting the second reflow.
(2) Do not perform flux cleaning with water after the first reflow.
Package peak temperature: 215
°
C, Reflow time: 40 seconds or
less (at 200
°
C or higher), Number of reflow processes: 2 or less
< Cautions >
(1) Wait for the device temperature to return to normal after the
first reflow before starting the second reflow.
(2) Do not perform flux cleaning with water after the first reflow.
Solder temperature: 260
°
C or below, Flow time: 10 seconds or
less, Number of flow processes: 1,
Preheating temperature: 120
°
C max. (package surface
temperature)
Pin temperature: 300
°
C or below,
Flow time: 3 seconds or less (per pin row)
IR35-00-2
VPS
VP15-00-2
Wave soldering
WS60-00-1
Partial heating
—
*
Caution Apply wave soldering only to the pins and be careful so as not to bring solder into direct contact with
the package.
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