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參數(shù)資料
| 型號： | 935285401518 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 網(wǎng)絡(luò)接口 |
| 英文描述： | DATACOM, INTERFACE CIRCUIT, PDSO14 |
| 封裝： | 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14 |
| 文件頁數(shù)： | 15/30頁 |
| 文件大小： | 262K |
| 代理商： | 935285401518 |
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TJA1055_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
22 of 26
NXP Semiconductors
TJA1055
Enhanced fault-tolerant CAN transceiver
14.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 12) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 10 and 11
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 12.
Table 10.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 11.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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