參數(shù)資料
型號(hào)： CBTL06121BHF
廠商： NXP Semiconductors N.V.
元件分類： 編、解碼器及復(fù)用、解復(fù)用
英文描述： Gen1 hex display multiplexer
封裝： CBTL06121AHF<SOT1033-1 (HWQFN56R)|<<http://www.nxp.com/packages/SOT1033-1.html<1<Always Pb-free,;CBTL06121BHF<SOT1033-1 (HWQFN56R)|<<http://www.nxp.com/packages/SOT1033-1
文件頁(yè)數(shù)： 7/20頁(yè)
文件大?。?/td> 162K
代理商： CBTL06121BHF
CBTL06121
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 26 October 2010
15 of 20
NXP Semiconductors
CBTL06121
Gen1 hex display multiplexer
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 9) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 13 and 14
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 9.
Table 13.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 14.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CBTL06121BHF,518 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 GEN1 HEX DISPLAY RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時(shí)間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray
CBTL06121BHF-T 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 GEN1 HEX DISPLAY MULTIPLEXER RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時(shí)間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray
CBTL06122 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:High-performance DisplayPort/PCIe Gen2 hex display multiplexer
CBTL06122AHF 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:High-performance DisplayPort/PCIe Gen2 hex display multiplexer
CBTL06122AHF,518 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 GEN1 HEX DISPLAY RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時(shí)間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray
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