詳細(xì)信息
軟板技術(shù)參數(shù)：
材料 Material | 軟性線路板FPC 軟軟硬結(jié)合Rigid---FlexPCB | 注解測(cè)試方式 Remark＆Test method | |
層數(shù) Layers | 1—10 2--10 | ||
最小線寬線距Width/space | Single-sided 0.05mm(2mil) | ||
Double-sided 0.05mm(2mil) | |||
尺寸公差 Dimension tolerance | 線寬 Line width | +/-0.03mm | W<=0.15mm H<=1.5MM P<=10MM Specicl +/-0.07mm Specicl +/-0.075mm |
孔徑hole | +/-0.02mm | ||
間距 Cumulate space | +/-0.05 | ||
外形outline | +/-0.1mm | ||
Confuctor to outline | +/-0.1mm | ||
最小孔徑 Hole(min) | 鉆孔Drill | 0.15mm | |
沖孔Punching | 0.50mm | ||
表面工藝 Surface treament | 鍍鎳/鍍金Ni/Au plating | Ni :2-8un(80uin-320uin) Au:0.05-0.125um(2uin-5uin) | |
沉金電鎳Electronic Nickle Immersion Gold(ENIG) | 鎳Ni:3-5um(120uin-200uin) 金Au>=0.05nm(2uin) Or specified by Customer Bonding:Ni:2-6um Au>=0.2um(thick Au) | ||
鍍錫 Tin Plating | 10-20um或者客戶指定 10-20um or specified by customer | ||
表面抗拉強(qiáng)度 Peel strength | 膠粘劑Adhesive:1.0mil | 1.0kgf/cm 1.0kgf/cm | IPC-TM-6502.4.9 |
膠粘劑Adhesive:0.5mil | 0.5kgf/cm 0.5kgf/cm | ||
焊劑高溫特性 Solder heat resistance | 300℃/10sec 300℃/10sec | IPC-TM-6502.4.3 | |
絕緣電阻Insulation Resistance | 500MΩ 500MΩ | IPC-TM-6502.6.3.2 | |
額定電壓 Dielectric with standing voltage | 500V 500V | IPC-TM-6502.5.7 | |
化學(xué)抗性 Chemical Resistance | 無(wú)色變 No discoloration No discoloration | IPC-TM-6502.3.2 | |
熱量變化Thermal block | 阻值變化不能超過(guò)+/-10% | IPC-TM-6502.6.7.2 | |