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參數(shù)資料
| 型號： | CXXXXR230-SXX00-X |
| 廠商： | Cree, Inc. |
| 英文描述： | XT⑩ Rectangular LEDs |
| 中文描述： | 矩形發(fā)光二極管xT配對⑩ |
| 文件頁數(shù)： | 1/4頁 |
| 文件大?。?/td> | 221K |
| 代理商： | CXXXXR230-SXX00-X |
Subject to change without notice.
www.cree.com
FEATURES
XT Rectangular LED Performance
460 nm & 470 nm
XR-18 – 18.0 mW min.
XR-21 – 21.0 mW min.
Thin 150 μm Chip
Low Forward Voltage – 3.2 Typical at 20 mA
Single Wire Bond Structure
Class 2 ESD Rating
Sn Contact for Low-Temp. Die Attach Methods
Die Attach Options:
Flux Eutectic; Flux & Temperature (-C)
Eutectic; Temperature & Pressure (-D)
–
–
–
APPLICATIONS
Mobile Appliance LCD Backlighting
Digital Camera Flash
XT
Rectangular LEDs
C
xxx
XR230-S
xx
00-
x
Cree’s XT Rectangular LEDs are the next generation of solid-state LEDs that combine highly efficient InGaN materials
with Cree’s proprietary GSiC
substrate to deliver superior price/performance for high-intensity LEDs. These LED
chips have a geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a single
wire bond connection. These vertically structured LED chips are approximately 150 microns in height and require a low
forward voltage. Cree’s XT Rectangular chips are tested for conformity to optical and electrical specifications and the
ability to withstand 1000 V ESD. Applications for XT Rectangular LEDs include next-generation mobile appliances for
use in their LCD backlights and digital camera flash where brightness, sub-miniaturization, and low power consumption
are required.
C
xxx
XR230-S
xx0
0-
x
Chip Diagram
Top View
Bottom View
Die Cross Section
GSiC LED Chip
230 x 380 μm
Gold Bond Pad
105 μm Diameter
SiC Substrate
t = 150 μm
Backside
Metalization
Cathode (-)
Anode (+)
D
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| CXXXXT290-SXX00-A | XThin㈢ LEDs |
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相關(guān)代理商/技術(shù)參數(shù) |
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| CXXXXT290-SXX00-A | 制造商:CREE 制造商全稱:Cree, Inc 功能描述:XThin㈢ LEDs |
| CXXXXT290-SXX00-X | 制造商:CREE 制造商全稱:Cree, Inc 功能描述:XThin㈢ LEDs |
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