參數(shù)資料
型號: CY7C1370D-167AXC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture
中文描述: 512K X 36 ZBT SRAM, 3.4 ns, PQFP100
封裝: 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
文件頁數(shù): 25/30頁
文件大?。?/td> 344K
代理商: CY7C1370D-167AXC
PRELIMINARY
CY7C1370D
CY7C1372D
Document #: 38-05555 Rev. *A
Page 25 of 30
Ordering Information
Speed
(MHz)
250
Ordering Code
CY7C1370D-250AXC
CY7C1372D-250AXC
CY7C1370D-250BGC
CY7C1372D-250BGC
CY7C1370D-250BZC
CY7C1372D-250BZC
CY7C1370D-225AXC
CY7C1372D-225AXC
CY7C1370D-225BGC
CY7C1372D-225BGC
CY7C1370D-225BZC
CY7C1372D-225BZC
CY7C1370D-200AXC
CY7C1372D-200AXC
CY7C1370D-200BGC
CY7C1372D-200BGC
CY7C1370D-200BZC
CY7C1372D-200BZC
CY7C1370D-167AXC
CY7C1372D-167AXC
CY7C1370D-167BGC
CY7C1372D-167BGC
CY7C1370D-167BZC
CY7C1372D-167BZC
Package
Name
A100RA
Package Type
Operating
Range
Commercial
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
BG119
119-ball Ball Grid Array (14 x 22 x 2.4 mm)
BB165D
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
225
A100RA
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
BG119
119-ball Ball Grid Array (14 x 22 x 2.4 mm)
BB165D
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
200
A100RA
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
BG119
119-ball Ball Grid Array (14 x 22 x 2.4 mm)
BB165D
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
167
A100RA
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
BG119
119-ball Ball Grid Array (14 x 22 x 2.4 mm)
BB165D
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
相關(guān)PDF資料
PDF描述
CY7C1370D-225AXC 18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture
CY7C1370D-167AXI 18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture
CY7C1370D-167BGC 18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture
CY7C1370D-167BGI 18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture
CY7C1370D-167BZC 18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1370D-167AXCB 功能描述:18MB SRAM RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:NoBL™ 標準包裝:1,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.173",4.40mm 寬) 供應商設(shè)備封裝:8-MFP 包裝:帶卷 (TR)
CY7C1370D-167AXCKJ 制造商:Cypress Semiconductor 功能描述:
CY7C1370D-167AXCT 功能描述:靜態(tài)隨機存取存儲器 512Kx36 3.3V NoBL Sync PL 靜態(tài)隨機存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1370D-167AXI 功能描述:靜態(tài)隨機存取存儲器 512Kx36 3.3V NoBL Sync PL 靜態(tài)隨機存取存儲器 IND RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1370D-167AXIKJ 制造商:Cypress Semiconductor 功能描述: