參數(shù)資料
型號(hào)： CY7C1383FV25-100BGI
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類： DRAM
英文描述： 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
中文描述： 1M X 18 CACHE SRAM, 8.5 ns, PBGA119
封裝： 14 X 22 MM, 2.40 MM HEIGHT, BGA-119
文件頁(yè)數(shù)： 27/28頁(yè)
文件大小： 952K
代理商： CY7C1383FV25-100BGI
CY7C1381DV25, CY7C1381FV25
CY7C1383DV25, CY7C1383FV25
Document #: 38-05547 Rev. *E
Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for
the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended
to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Page 27 of 28
Intel and Pentium are registered trademarks, and i486 is a trademark of Intel Corporation. All product and company names
mentioned in this document are the trademarks of their respective holders.
Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
Package Diagrams
(continued)
A
PIN 1 CORNER
1
13.00±0.10
7
1.00
0.50 (0.25 M C A B
0.25 M0.05 M C
0.05 M C
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
5
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10.00
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B
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1
5.00
0
0.50 (165X)
1
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
PACKAGE CODE : BB0AC
51-85180-*A
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
A
1
PIN 1 CORNER
1
13.00±0.10
7
1.00
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2
3
4
5
6
7
8
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10
10.00
1
B
C
D
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A
1
13.00±0.10
B
C
1
5.00
0
PACKAGE WEIGHT : 0.475g
51-85180-*A
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CY7C1383FV25-100BGXC 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
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