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參數(shù)資料
| 型號(hào)： | CY7C1475V25-133BGXC |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture |
| 中文描述： | 1M X 72 ZBT SRAM, 6.5 ns, PBGA209 |
| 封裝： | 14 X 22 MM, 1.76 MM HEIGHT, LEAD FREE, FBGA-209 |
| 文件頁數(shù)： | 22/30頁 |
| 文件大?。?/td> | 373K |
| 代理商： | CY7C1475V25-133BGXC |
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PRELIMINARY
CY7C1471V25
CY7C1473V25
CY7C1475V25
Document #: 38-05287 Rev. *E
Page 22 of 30
Thermal Resistance
[15]
Parameter
Θ
JA
Description
Test Conditions
165 fBGA
Package
16.3
209 BGA
Package
15.2
TQFP
Package
24.63
Unit
°
C/W
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Test conditions follow standard test
methods and procedures for
measuring thermal impedance, per
EIA / JESD51.
Θ
JC
2.1
1.7
2.28
°
C/W
Capacitance
[15]
Parameter
Description
Test Conditions
TQFP
Max.
209-BGA
Max.
165-fBGA
Max.
Unit
C
ADDRESS
Address Input Capacitance
T
A
= 25
°
C, f = 1 MHz,
V
DD
= 2.5V
V
DDQ
= 2.5V
6
6
6
pF
C
DATA
Data Input Capacitance
5
5
5
pF
C
CTRL
Control Input Capacitance
8
8
8
pF
C
CLK
Clock Input Capacitance
6
6
6
pF
C
I/O
Input/Output Capacitance
5
5
5
pF
AC Test Loads and Waveforms
Note:
15.Tested initially and after any design or process change that may affect these parameters
OUTPUT
R = 1667
R = 1538
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Z
0
= 50
V
L
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤
1 ns
≤
1 ns
(c)
2.5V I/O Test Load
OUTPUT
R = 14K
R = 14K
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Z
0
= 50
V
L
= 0.9V
1.8V
ALL INPUT PULSES
V
DDQ
- 0.2
0.2
90%
10%
90%
10%
≤
1 ns
≤
1 ns
(c)
1.8V I/O Test Load
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PDF描述 |
|---|---|
| CY7C1471V33-133AXC | 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture |
| CY7C1471V33-133BZC | 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture |
| CY7C1475V33-100BGC | 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture |
| CY7C1475V33-100BGXC | 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture |
| CY7C1475V33-133BGC | 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C1475V33-100AXC | 制造商:Cypress Semiconductor 功能描述:72MB (1MBX72) NOBL FLOW-THRU, 3.3V CORE, 2.5/3.3V I/O - Bulk |
| CY7C1475V33-100BGC | 制造商:Cypress Semiconductor 功能描述:SRAM SYNC SGL 3.3V 72MBIT 1MX72 8.5NS 209FBGA - Bulk |
| CY7C1475V33-133BGC | 制造商:Cypress Semiconductor 功能描述:SRAM SYNC OCTAL 3.3V 72MBIT 1MX72 6.5NS 209FBGA - Bulk |
| CY7C14802BC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C14802XC | 制造商:Cypress Semiconductor 功能描述: |
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