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參數(shù)資料
| 型號： | CY7C1483V33-133AXI |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM |
| 中文描述： | 4M X 18 CACHE SRAM, 6.5 ns, PQFP100 |
| 封裝： | 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100 |
| 文件頁數(shù)： | 20/30頁 |
| 文件大?。?/td> | 998K |
| 代理商： | CY7C1483V33-133AXI |
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CY7C1481V33
CY7C1483V33
CY7C1487V33
Document #: 38-05284 Rev. *H
Page 20 of 30
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
Test Conditions
100 TQFP
Max
6
5
8
6
5
165 FBGA
Max
6
5
8
6
5
209 FBGA
Max
6
5
8
6
5
Unit
C
ADDRESS
C
DATA
C
CTRL
C
CLK
C
I/O
Address Input Capacitance
Data Input Capacitance
Control Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
T
A
= 25
°
C, f = 1 MHz,
V
DD
= 3.3V
V
DDQ
= 2.5V
pF
pF
pF
pF
pF
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
Test Conditions
100 TQFP
Package
24.63
165 FBGA
Package
16.3
209 FBGA
Package
15.2
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
°
C/W
Θ
JC
2.28
2.1
1.7
°
C/W
AC Test Loads and Waveforms
OUTPUT
R = 317
R = 351
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Z
0
= 50
V
L
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤
1 ns
≤
1 ns
(c)
OUTPUT
R = 1667
R = 1538
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Z
0
= 50
V
L
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤
1 ns
≤
1 ns
(c)
3.3V IO Test Load
2.5V IO Test Load
[+] Feedback
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| CY7C1483V33-133BZI | 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM |
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| CY7C1483V33-133BZXI | 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM |
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