參數(shù)資料
型號: CY7C1526V18-200BZXC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 72-Mbit QDR⑩- II SRAM 4-Word Burst Architecture
中文描述: 8M X 9 QDR SRAM, 0.45 ns, PBGA165
封裝: 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
文件頁數(shù): 10/28頁
文件大?。?/td> 426K
代理商: CY7C1526V18-200BZXC
CY7C1511V18
CY7C1526V18
CY7C1513V18
CY7C1515V18
Document #: 38-05363 Rev. *D
Page 10 of 28
Write Cycle Descriptions
CY7C1511V18 and CY7C1513V18)
[3, 11]
BWS
0
/
NWS
0
BWS
1
/
NWS
1
L
K
K
Comments
L
L–H
During the Data portion of a Write sequence
:
CY7C1511V18
both nibbles (D
[7:0]
) are written into the device,
CY7C1513V18
both bytes (D
[17:0]
) are written into the device.
During the Data portion of a Write sequence
:
CY7C1511V18
both nibbles (D
[7:0]
) are written into the device,
CY7C1513V18
both bytes (D
[17:0]
) are written into the device.
During the Data portion of a Write sequence
:
CY7C1511V18
only the lower nibble (D
[3:0]
) is written into the device. D
[7:4]
will remain unaltered,
CY7C1513V18
only the lower byte (D
[8:0]
) is written into the device. D
[17:9]
will remain unaltered.
During the Data portion of a Write sequence
:
CY7C1511V18
only the lower nibble (D
[3:0]
) is written into the device. D
[7:4]
will remain unaltered,
CY7C1513V18
only the lower byte (D
[8:0]
) is written into the device. D
[17:9]
will remain unaltered.
During the Data portion of a Write sequence
:
CY7C1511V18
only the upper nibble (D
[7:4]
) is written into the device. D
[3:0]
will remain unaltered,
CY7C1513V18
only the upper byte (D
[17:9]
) is written into the device. D
[8:0]
will remain unaltered.
During the Data portion of a Write sequence
:
CY7C1511V18
only the upper nibble (D
[7:4]
) is written into the device. D
[3:0]
will remain unaltered,
CY7C1513V18
only the upper byte (D
[17:9]
) is written into the device. D
[8:0]
will remain unaltered.
No data is written into the devices during this portion of a write operation.
No data is written into the devices during this portion of a write operation.
L
L
L-H
L
H
L–H
L
H
L–H
H
L
L–H
H
L
L–H
H
H
H
H
L–H
L–H
Note:
11. Assumes a Write cycle was initiated per the Write Port Cycle Description Truth Table.NWS
0
, NWS
1
, BWS
0
, BWS
1
, BWS
2
,
and BWS
3
can be altered on different
portions of a write cycle, as long as the set-up and hold requirements are achieved.
[+] Feedback
相關PDF資料
PDF描述
CY7C1526V18-200BZXI 72-Mbit QDR⑩- II SRAM 4-Word Burst Architecture
CY7C1526V18-250BZI 72-Mbit QDR⑩- II SRAM 4-Word Burst Architecture
CY7C1526V18-250BZXC 72-Mbit QDR⑩- II SRAM 4-Word Burst Architecture
CY7C1526V18-250BZXI 72-Mbit QDR⑩- II SRAM 4-Word Burst Architecture
CY7C1526V18-278BZC 72-Mbit QDR⑩- II SRAM 4-Word Burst Architecture
相關代理商/技術參數(shù)
參數(shù)描述
CY7C1543KV18-400BZC 功能描述:靜態(tài)隨機存取存儲器 72MB (4Mx18) 1.8v 400MHz QDR II 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1543KV18-400BZI 功能描述:靜態(tài)隨機存取存儲器 72MB (4Mx18) 1.8v 400MHz QDR II 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1543KV18-450BZC 功能描述:靜態(tài)隨機存取存儲器 4Mb x 18 450 MHz RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1543KV18-450BZI 功能描述:靜態(tài)隨機存取存儲器 72MB (8Mx9) 1.8v 450MHz QDR II 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1543V18-333BZC 功能描述:靜態(tài)隨機存取存儲器 72M Q2+ B4 (2.0) RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray