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參數(shù)資料
| 型號(hào)： | DF16-50DS-0.5V |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 0.5mm Pitch SMT Board to Board Connector |
| 中文描述： | 0.5mm間距表面貼裝板對(duì)板連接器 |
| 文件頁(yè)數(shù)： | 11/11頁(yè) |
| 文件大小： | 236K |
| 代理商： | DF16-50DS-0.5V |
250
200
150
100
50
0
0SSEC
50SSEC
100SSEC
150SSEC
200SSEC
Time
Soldering area
Preheating area
Max 240
220
Temperature
Preheating area
Soldering area
IR reflow condition
150
235±5
220 min.
30 to 90 seconds
10 seconds max.
10 to 20 seconds
A318
1.
Recommended Temperature Profile (SMT)
2.
Recommended Manual Soldering Condition (SMT)
3.
Recommended Screen Thickness (SMT)
4. Board Warp (SMT)
5. Cleaning Condition
6. Cautions
Note1: Maximun twice actions are allowed under the same condition. However, the interval
between the first and second actions must be maintained at the room temperature.
Note2: The temperature indicates the board surface temperature of the connector lead area.
Soldering iron temperature: 290
±
10
, Soldering time: Within 2 seconds
0.15mm
Maximum 0.2mm in the connector center area, based on the both connector edges
Refer to the "Nylon Connector Use Hand book".
I
The header is designed in a structure where contacts are exposed. Touching it with bare hands
would cause contact failure or electrostatic element damage.
I
Where no board is mounted, the insertion or extraction will cause damage or contact deformation.
I
Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
I
Excessive scoop insertion or extraction may result in damage.
I
In the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.
I
The color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.
B
Precautions
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DF1657ATE35V | 功能描述:IC H8SX MCU FLASH 768K 120TQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8SX/1600 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤(pán) 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| DF16-60DP-0.5V | 制造商:HRS 制造商全稱(chēng):HRS 功能描述:0.5mm Pitch SMT Board to Board Connector |
| DF16-60DS-0.5V | 制造商:HRS 制造商全稱(chēng):HRS 功能描述:0.5mm Pitch SMT Board to Board Connector |
| DF16-60DS-0.5V(80) | 制造商:Hirose 功能描述: |
| DF16-60DS-0.5V(86) | 功能描述:板對(duì)板與夾層連接器 60P DBL ROW RECEPT STRAIGHT SMT RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類(lèi)型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點(diǎn)數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
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