參數(shù)資料
型號: DF16C-16DP-0.5V
廠商: Hirose Electric USA, INC.
英文描述: 0.5mm Pitch SMT Board to Board Connector
中文描述: 0.5mm間距表面貼裝板對板連接器
文件頁數(shù): 11/11頁
文件大?。?/td> 236K
代理商: DF16C-16DP-0.5V
250
200
150
100
50
0
0SSEC
50SSEC
100SSEC
150SSEC
200SSEC
Time
Soldering area
Preheating area
Max 240
220
Temperature
Preheating area
Soldering area
IR reflow condition
150
235±5
220 min.
30 to 90 seconds
10 seconds max.
10 to 20 seconds
A318
1.
Recommended Temperature Profile (SMT)
2.
Recommended Manual Soldering Condition (SMT)
3.
Recommended Screen Thickness (SMT)
4. Board Warp (SMT)
5. Cleaning Condition
6. Cautions
Note1: Maximun twice actions are allowed under the same condition. However, the interval
between the first and second actions must be maintained at the room temperature.
Note2: The temperature indicates the board surface temperature of the connector lead area.
Soldering iron temperature: 290
±
10
, Soldering time: Within 2 seconds
0.15mm
Maximum 0.2mm in the connector center area, based on the both connector edges
Refer to the "Nylon Connector Use Hand book".
I
The header is designed in a structure where contacts are exposed. Touching it with bare hands
would cause contact failure or electrostatic element damage.
I
Where no board is mounted, the insertion or extraction will cause damage or contact deformation.
I
Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
I
Excessive scoop insertion or extraction may result in damage.
I
In the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.
I
The color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.
B
Precautions
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