參數(shù)資料
型號: DF23C-18DS-0.5V
廠商: Hirose Electric USA, INC.
英文描述: 0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors
中文描述: 0.5mm間距低輪廓Board-to-Board/Board-to-FPC連接器
文件頁數(shù): 7/8頁
文件大?。?/td> 184K
代理商: DF23C-18DS-0.5V
7
B
Usage Precautions
Note 1: Up to 2 cycles are possible under the same conditions provided that there is a return to normal
temperature between the first and second cycle.
Note 2: This temperature profile indicates the temperature of the connector terminal lead at the point of contact
with the PCB.
1.Recommended
Temperature Profile
Temperature
2.Recommended Manual
Soldering Conditions
4.Board Warping
I
Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points.
I
Refer to the "Nylon Connector Use Handbook."
I
When manually handling the connectors avoid touching any portion of exposed terminal leads.
I
This may cause deformation and lead to difficulties with placement and soldering on the PCB.
When mating/un-mating do not use excessive force or lifting of one side only.
5.Cleaning Conditions
6.
Use and handling precautions.
3.Recommended Screen
Thickness and Open Area
Ratio (Pattern Area Ratio)
Temperature: 290
±
10
, Soldering time: within 2 sec.
I
IR only, or with the addition of hot air (at the recommended temperature profile)
I
Thickness : 0.12 to 0.15mm
I
Open Area ratio: 100%
I
Together with the N2 gas
I
Set the open area ratio according to the following guide.
(Maximum temperature -20
): 30 sec. max.
Thickness
Maximum Temperature (5 sec. max.)
0.12mm
220
100%
100%
230
100%
1
80%
240
1
70%
1
60%
250
1
50%
1
50%
0.15mm
Open Area Ratio
0
50
100
150
150
30 sec. to 90 sec.
235
±
5 10 sec. max.
220
min.
10 sec. to 20 sec.
200
250
Temperature
50 s
Preheating
IR Reflow
Preheating :
Soldering :
Soldering
0 s
90 s
150 s Time
Maximum. 240
220
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