參數(shù)資料
型號(hào)： DS3154
英文描述： Single/Dual/Triple/Quad DS3/E3/STS-1 LIUs
中文描述： 單/雙/三/四路、DS3/E3/STS-1 LIU
文件頁(yè)數(shù)： 60/60頁(yè)
文件大?。?/td> 788K
代理商： DS3154
DS3151/DS3152/DS3153/DS3154 Single/Dual/Triple/Quad DS3/E3/STS-1 LIUs
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
2003 Maxim Integrated Products Printed USA
60 of 60
16.
Table 16-A. Thermal Properties, Natural Convection
PARAMETER
Ambient Temperature (Note 1)
Junction Temperature
Theta
-
JA (
JA
), Still Air (Note 2)
Psi-JB
Psi-JT
Note 1:
The package is mounted on a four
-
layer JEDEC standard test board with no airflow and dissipating maximum power.
Note 2:
Theta
-
JA (
JA
) is the junction-to-ambient thermal resistance, when the package is mounted on a four
-
layer JEDEC standard test board
with no airflow and dissipating maximum power.
Table 16-B. Theta-JA (
JA
) vs. Airflow
FORCED AIR (m/s)
THETA-JA (
JA
)
0
22.4 C/W
1
19.0 C/W
2.5
17.2 C/W
17.
REVISION HISTORY
THERMAL INFORMATION
MIN
-40
-40
TYP
22.4
9.2
1.6
MAX
+85
+125
UNITS
C
C
C/W
C/W
C/W
REVISION
DESCRIPTION
012103
DS3154 new product release
040403
DS3151/DS3152/DS3153 new product releases.
Electrical Characteristics
section, Notes 1 and 2: Changed 44.73MHz to 51.84MHz; added indication that
specs are lower for rev A2; “all ones driven into RXPn/RXNn (1.0V square wave)” changed to “analog
loopback enabled” to match production test methodology.
Table 13-B, Input leakage, I
IL
: -10 A min changed to -50 A min.
Table 13-B: Replaced TBD values for I
DD
, I
DDTS
, and I
DDPD
(DS3151/DS3152/DS3153); changed I
DDPD
spec from 38 typ and 50 max to 45 typ and 70 max.
Table 14-A and Table 14-B: Changed pins RBIN, RCINV, TBIN, and TCINV to “N.C.” to reflect they are
not available in CPU bus mode.
072303
Figure 1-1: Labeled capacitors connected to transformer center taps as “(optional)”.
Section 6, Optional Pre-Amp Paragraph: Clarified that the pre-amp contributes +14dB of flat gain.
Table 11-A: Changed leakage inductance to 0.150 H max.
Table 11-B: Reformatted table and added row for Pulse Engineering’s T3049 octal transformer.
Table 13-H: Reworded Note 20.
120303
GCR Register Definition (page 16): Clarified that RST bit holds the digital logic of the LIU in reset rather
than the whole LIU.
Table 13-B: Changed DS3151 I
DD
from 130mA (max) to 100mA (max). Changed DS3151 I
DDTTS
from
105mA (max) to 80mA (max). Removed sentences in Notes 1 and 2 that labeled I
DD
and I
DDTTS
specs for
rev A1 devices.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS3154+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3/STS-1 Line Interface Unit RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3154A2 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3/STS-1 Line Interface Unit RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3154DK 功能描述:網(wǎng)絡(luò)開發(fā)工具 DS3154 Dev Kit RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評(píng)估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V
DS3154N 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3/STS-1 Line Interface Unit RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3154N# 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3/STS-1 Line Interface Unit RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
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