嵌入式 - 微控制器， HD6417751BP167IV品牌、價(jià)格、PDF參數(shù)
HD6417751BP167IV • 品牌、價(jià)格
| 元器件型號(hào) |
廠商 |
描述 |
數(shù)量 |
價(jià)格 |
| HD6417751BP167IV |
Renesas Electronics America |
MPU 3V 0 ROM I-TEMP PB-FREE 256 |
0 |
1:$52.04000
|
| HD6417751BP167V |
Renesas Electronics America |
MPU 3V 16K 256-BGA |
0 |
1:$52.04000
|
| HD6417751F167IV |
Renesas Electronics America |
MPU 1.8/3.3V 0K I-TEMP PB-FREE 2 |
0 |
1:$53.65000
|
| HD6417751F167V |
Renesas Electronics America |
MPU 1.8/3.3V 0K PB-FREE 256-QFP |
0 |
1:$49.03000
|
| HD6417751RBP240D |
Renesas Electronics America |
MCU RISC ROMLESS 256-BGA |
0 |
1:$63.41000
|
| HD6417751RF200DV |
Renesas Electronics America |
MPU 3V 16K I-TEMP,PB-FREE 208-QF |
0 |
1:$52.80000
|
| HD6417751RF200V |
Renesas Electronics America |
MPU 3V 16K PB-FREE 208-QFP |
0 |
1:$47.88000
|
| HD6417751RF240DV |
Renesas Electronics America |
MPU 3V 16K I-TEMP PB-FREE 208-QF |
0 |
1:$60.38000
|
| HD6473278F10V |
Renesas Electronics America |
MCU 8BIT 5V 16K ROM OTP 64QFP |
0 |
1:$23.04000
|
| HD64F3062BFI25Q |
Renesas Electronics America |
MCU 16BIT 5V 128K 100QFP |
0 |
1:$30.90000
|
| HD64F3062BFI25-TR |
Renesas Electronics America |
MCU 5V 128K I-TEMP 100-QFP T&R |
0 |
|
| HD64F3067RVX13 |
Renesas Electronics America |
MCU 16BIT FLASH 3V 100QFP |
0 |
1:$36.00000
|
| HD64F36049GH-T |
Renesas Electronics America |
MCU 3/5V 96K POR&LVD 80-QFP T&R |
0 |
|
| HD64F3684GD |
Renesas Electronics America |
MCU 16BIT FLASH 3/5V 32K 64QFP |
0 |
1:$12.32000
|
| HD64F7047F50MV |
Renesas Electronics America |
MCU 5V 256K PB-FREE 100-QFP |
0 |
|
| HD64F7065AF60V |
Renesas Electronics America |
MCU 3V 256K PB-FREE 176-QFP |
0 |
1:$89.20000
|
HD6417751BP167IV • PDF參數(shù)
| 類別: |
嵌入式 - 微控制器，
|
| 核心處理器: |
SH-4
|
| 芯體尺寸: |
32-位
|
| 速度: |
167MHz
|
| 連通性: |
EBI/EMI，F(xiàn)IFO，SCI，智能卡
|
| 外圍設(shè)備: |
DMA，POR，WDT
|
| 輸入/輸出數(shù): |
39
|
| 程序存儲(chǔ)器容量: |
-
|
| 程序存儲(chǔ)器類型: |
ROMless
|
| EEPROM 大小: |
-
|
| RAM 容量: |
24K x 8
|
| 電壓 - 電源 (Vcc/Vdd): |
1.6 V ~ 2 V
|
| 數(shù)據(jù)轉(zhuǎn)換器: |
-
|
| 振蕩器型: |
外部
|
| 工作溫度: |
-40°C ~ 85°C
|
| 封裝/外殼: |
256-BBGA
|
| 包裝: |
托盤
|