參數(shù)資料
型號: EL5420CRZ-T13
廠商: INTERSIL CORP
元件分類: 運(yùn)算放大器
英文描述: 12MHz Rail-to-Rail Input-Output Op Amps
中文描述: QUAD OP-AMP, 12000 uV OFFSET-MAX, 8 MHz BAND WIDTH, PDSO14
封裝: ROHS COMPLIANT, PLASTIC, MO-153AC, TSSOP-14
文件頁數(shù): 3/13頁
文件大?。?/td> 275K
代理商: EL5420CRZ-T13
11
EL5220C, EL5420C
12MHz Rail-to-Rail Input-Output Op Amps
E
L
52
20
C
,E
L
54
20
C
Figure 2. Operation with Beyond-the-Rails
Input
Power Dissipation
With the high-output drive capability of the EL5220C
and EL5420C amplifiers, it is possible to exceed the
125°C “absolute-maximum junction temperature” under
certain load current conditions. Therefore, it is important
to calculate the maximum junction temperature for the
application to determine if load conditions need to be
modified for the amplifier to remain in the safe operating
area.
The maximum power dissipation allowed in a package is
determined according to:
where:
TJMAX = Maximum Junction Temperature
TAMAX= Maximum Ambient Temperature
θJA = Thermal Resistance of the Package
PDMAX = Maximum Power Dissipation in the Package
The maximum power dissipation actually produced by
an IC is the total quiescent supply current times the total
power supply voltage, plus the power in the IC due to the
loads, or:
when sourcing, and:
when sinking.
where
i = 1 to 2 for Dual and 1 to 4 for Quad
VS = Total Supply Voltage
ISMAX = Maximum Supply Current Per Amplifier
VOUTi = Maximum Output Voltage of the Application
ILOADi = Load Current
If we set the two PDMAX equations equal to each other,
we can solve for RLOADi to avoid device overheat. Fig-
ures 3, 4, and 5 provide a convenient way to see if the
device will overheat. The maximum safe power dissipa-
tion can be found graphically, based on the package type
and the ambient temperature. By using the previous
equation, it is a simple matter to see if PDMAX exceeds
the device's power derating curves. To ensure proper
operation, it is important to observe the recommended
derating curves in Figures 3, 4, and 5.
Figure 3. Package Power Dissipation vs
Ambient Temperature
VS=±2.5V
TA=25°C
AV=1
VIN=6VP-P
1V
100s
1V
PDMAX
TJMAX TAMAX
ΘJA
------------------------------------------------
=
PDMAX
ΣiVS ISMAX VS+
(
VOUTi) ILOADi
×
+
×
[]
×
=
PDMAX
ΣiVS ISMAX VOUTi
(
VS- ) ILOADi
×
+
×
[]
×
=
400
800
Po
w
er
Di
ss
ip
at
io
n
(m
W
)
Ambient Temperature (°C)
0
1200
MAX TJ=125°C
1000
600
200
TSSOP14
θJA=100°C/W
25
50
75
100
125
150
85
JEDEC JESD51-7 High Effective Thermal Conductivity (4-
Layer) Test Board
LPP exposed diepad soldered to PCB per JESD51-5
1.136W
SO14
θJA=88°C/W
1.0W
870mW
MSOP8
θJA=115°C/W
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