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參數(shù)資料
| 型號(hào)： | EL7155CS |
| 廠商： | ELANTEC |
| 元件分類(lèi)： | 外設(shè)及接口 |
| 英文描述： | High Performance Pin Driver |
| 中文描述： | 3.5 A HALF BRIDGE BASED PRPHL DRVR, PDSO8 |
| 封裝： | SO-8 |
| 文件頁(yè)數(shù)： | 10/10頁(yè) |
| 文件大?。?/td> | 207K |
| 代理商： | EL7155CS |
9
EL7155C
High-Performance Pin Driver
EL
7155C
Power Supply Bypassing
When using the EL7155C, it is very important to use
adequate power supply bypassing. The high switching
currents developed by the EL7155C necessitate the use
of a bypass capacitor between the VS+ and GND pins. It
is recommended that a 2.2F tantalum capacitor be used
in parallel with a 0.1 F low-inductance ceramic MLC
capacitor. These should be placed as close to the supply
pins as possible. It is also recommended that the VH and
VL pins have some level of bypassing, especially if the
EL7155C is driving highly capacitive loads.
Power Dissipation Calculation
When switching at high speeds, or driving heavy loads,
the EL7155C drive capability is limited by the rise in die
temperature brought about by internal power dissipation.
For reliable operation die temperature must be kept
below Tjmax (125°C). It is necessary to calculate the
power dissipation for a given application prior to select-
ing the package type.
Power dissipation may be calculated:
where:
VS is the total power supply to the EL7155C (from
VS+ to GND),
Vout is the swing on the output (VH - VL),
CL is the load capacitance,
CINT is the internal load capacitance (50pF max.),
IS is the quiescent supply current (3mA max.) and
f is frequency
Having obtained the application’s power dissipation, a
maximum package thermal coefficient may be deter-
mined, to maintain the internal die temperature below
Tjmax:
where:
Tjmax is the maximum junction temperature (125°C),
Tmax is the maximum operating temperature,
PD is the power dissipation calculated above,
θja thermal resistance on junction to ambient.
θja is 160°C/W for the SO8 package and 100°C/W for
the PDIP8 package when using a standard JEDEC
JESD51-3 single-layer test board. If Tjmax is greater than
125°C when calculated using the equation above, then
one of the following actions must be taken:
Reduce
θja the system by designing more heat-sinking
into the PCB (as compared to the standard JEDEC
JESD51-3)
Use the PDIP8 instead of the SO8 package
De-rate the application either by reducing the switch-
ing frequency, the capacitive load, or the maximum
operating (ambient) temperature (Tmax)
PD
V
S
(
I
S )
C
INT
(
V
S
2
f
)
C
L
(
V
OU T
2
f
)
×
+
×
+
×
=
θ
ja
T
jmax
(
T
ma x )
–
PD
--------------------------------------
=
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EL7155CS-T13 | 功能描述:IC PIN DRIVER 40MHZ 3ST 8-SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> PMIC - MOSFET，電橋驅(qū)動(dòng)器 - 內(nèi)部開(kāi)關(guān) 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 類(lèi)型:高端/低端驅(qū)動(dòng)器 輸入類(lèi)型:SPI 輸出數(shù):8 導(dǎo)通狀態(tài)電阻:850 毫歐，1.6 歐姆 電流 - 輸出 / 通道:205mA，410mA 電流 - 峰值輸出:500mA，1A 電源電壓:9 V ~ 16 V 工作溫度:-40°C ~ 150°C 安裝類(lèi)型:表面貼裝 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:PG-DSO-20-45 包裝:帶卷 (TR) |
| EL7155CS-T7 | 功能描述:IC PIN DRIVER 40MHZ 3ST 8-SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> PMIC - MOSFET，電橋驅(qū)動(dòng)器 - 內(nèi)部開(kāi)關(guān) 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 類(lèi)型:高端/低端驅(qū)動(dòng)器 輸入類(lèi)型:SPI 輸出數(shù):8 導(dǎo)通狀態(tài)電阻:850 毫歐，1.6 歐姆 電流 - 輸出 / 通道:205mA，410mA 電流 - 峰值輸出:500mA，1A 電源電壓:9 V ~ 16 V 工作溫度:-40°C ~ 150°C 安裝類(lèi)型:表面貼裝 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:PG-DSO-20-45 包裝:帶卷 (TR) |
| EL7155CSZ | 功能描述:功率驅(qū)動(dòng)器IC EL7155CSZ 40MHZ PIN DRVR W/LVL SHIFTER RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類(lèi)型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| EL7155CSZ | 制造商:Intersil Corporation 功能描述:IC PIN DRIVER 3.5A |
| EL7155CSZ-T13 | 功能描述:功率驅(qū)動(dòng)器IC EL7155CSZ 40 MHZ PIN DRVR W/LVL SHIFTER RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類(lèi)型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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