參數(shù)資料
型號： AD8224ACPZ-WP
廠商： Analog Devices Inc
文件頁數(shù)： 28/28頁
文件大?。?/td> 0K
描述： IC AMP INST JFET R-R LP 16LFCSP
標準包裝： 64
放大器類型： 儀表
電路數(shù)： 2
輸出類型： 滿擺幅
轉(zhuǎn)換速率： 2 V/µs
-3db帶寬： 1.5MHz
電流 - 輸入偏壓： 25pA
電壓 - 輸入偏移： 300µV
電流 - 電源： 750µA
電流 - 輸出 / 通道： 15mA
電壓 - 電源，單路/雙路(±)： 4.5 V ~ 36 V，±2.25 V ~ 18 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 16-VQFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 16-LFCSP-VQ
包裝： 托盤 - 晶粒
配用： AD8224-EVALZ-ND - BOARD EVALUATION AD8224
Data Sheet
AD8224
Rev. C | Page 9 of 28
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
Rating
Supply Voltage
±18 V
Power Dissipation
Output Short-Circuit Current
Indefinite1
Input Voltage (Common Mode)
±VS
Differential Input Voltage
±VS
Storage Temperature Range
65°C to +130°C
Operating Temperature Range2
40°C to +125°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
130°C
Package Glass Transition Temperature
130°C
ESD (Human Body Model)
4 kV
ESD (Charge Device Model)
1 kV
ESD (Machine Model)
0.4 kV
1 Assumes the load is referenced to midsupply.
2 Temperature for specified performance is 40°C to +85°C. For performance
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 9.
Exposed Paddle Package
θJA
Unit
CP-16-13: LFCSP, EPAD Soldered to Board
48
°C/W
CP-16-13: LFCSP, EPAD Not Soldered to Board
86
°C/W
Table 10.
Hidden Paddle Package
θJA
Unit
CP-16-19: LFCSP
86
°C/W
The θJA values in Table 9 and Table 10 assume a 4-layer JEDEC
standard board. If the thermal pad is soldered to the board, it is
also assumed it is connected to a plane. θJC at the exposed pad is
4.4°C/W.
Maximum Power Dissipation
The maximum safe power dissipation for the AD8224 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 130°C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality. Figure 2
shows the maximum safe power dissipation in the package vs.
the ambient temperature for the LFCSP on a 4-layer JEDEC
standard board.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
–60
–40
–20
0
20
40
60
80
100
120
140
06286-
002
AMBIENT TEMPERATURE (°C)
MA
XI
MU
M
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
θJA = 48°C/W WHEN THERMAL PAD
IS SOLDERED TO BOARD
θJA = 86°C/W WHEN THERMAL PAD
IS NOT SOLDERED TO BOARD
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
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