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參數(shù)資料
| 型號(hào)： | EPF10K130V |
| 廠商： | Altera Corporation |
| 英文描述： | EMBEDDED PROGRAMMABLE LOGIC FAMILY |
| 中文描述： | 嵌入式可編程邏輯系列 |
| 文件頁(yè)數(shù)： | 52/120頁(yè) |
| 文件大小： | 1901K |
| 代理商： | EPF10K130V |
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Altera Corporation
37
FLEX 10KE Embedded Programmable Logic Family Data Sheet
SameFrame
Pin-Outs
FLEX 10KE devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPF10K30E device in a 256-pin
FineLine BGA package to an EPF10K200S device in a 672-pin
FineLine BGA package.
The MAX+PLUS II software provides support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and
future use. The MAX+PLUS II software generates pin-outs describing
how to lay out a board to take advantage of this migration (see Figure 18).
Figure 18. SameFrame Pin-Out Example
Designed for 256-Pin FineLine BGA Package
Printed Circuit Board
100-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
256-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
100-Pin
FineLine
BGA
256-Pin
FineLine
BGA
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EPF10K130VBC600-2 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| EPF10K130VBC600-3 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| EPF10K130VBC600-4 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| EPF10K130VGC599-2 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Altera Corporation 功能描述: |
| EPF10K130VGC599-3 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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