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參數(shù)資料
| 型號(hào)： | EVAL-ADN2843 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 10.709 Gbps Laser Diode Driver Chipset |
| 中文描述： | 10.709 Gbps的激光二極管驅(qū)動(dòng)器芯片組 |
| 文件頁(yè)數(shù)： | 10/12頁(yè) |
| 文件大小： | 710K |
| 代理商： | EVAL-ADN2843 |
REV. 0
–10–
ADN2843
Figure 5. Recommended Layout
GROUND PLANE
PARALLEL PLATE
DECOUPLING
CAPACITOR
NOTES
FOR OPTIMUM PERFORMANCE, RIBBON BONDS ARE RECOMMENDED ON PADS 1, 5, 12, AND 14. WIRES ARE 3 MIL OR 5 MIL RIBBONS <400 m
LONG. ALL OTHER PINS CAN BE ROUND WIRE <1mm.
LASER’S ANODE IS CONNECTED TO V
CC
THROUGH GOLD LAYER ON TOP OF CERAMIC STANDOFF. STANDOFF MINIMIZES LENGTH OF PAD
12 AND PAD 14 RIBBONS.
PARALLEL PLATE DECOUPLING CAPACITORSSHOULD BE >100pF AND BE OF MICROWAVEAVX TYPE, PART NO. GB0159391KA6N (390pF).
THE RECOMMENDED SUBSTRATE CONNECTION IS TO GND. HOWEVER, PERFORMANCE IS NOT AFFECTED BY CONNECTING THE
SUBSTRATE TO VCC.
AN INDUCTOR SHOULD BE USED IN THE BIAS CURRENT PATH. A MICROWAVE COMPONENTS COIL 30-1847-GCCAS-01 (48 MIL 24 MIL)
SHOULD BE USED.
THE EXTERNAL POWER SUPPLY IS CONNECTED AT THE PARALLEL PLATE DECOUPLING CAPACITOR.
MPD
50 TRANSMISSION LINE
GROUND PLANE
IBIAS OUTPUT INDUCTOR
LASER LIGHT
LASER
CERAMIC WITH GOLD
SURFACE THAT CONTACTS
THE LASER’S ANODE
PARALLEL PLATE
DECOUPLING
CAPACITORS
BACK FACET LIGHT
ADN2845
18
15
14
10
9
6
5
1
AGND
V
CC
V
CC
V
CC
V
CC
IMODP
IBIAS
AGND
ALS IMOD_CTRL IBIAS_CTRL
AGND
DATAP
AGND
DATAN
IMODNTERM
Figure 6. 10 Gbps Optical Diagram Provided Courtesy of NEL.
P
AV
= 0 dBm, ER = 5 dB, PRBS 31 Pattern.
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