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Package Type:
0 to 8
°
Detail A
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
.0069 ± .0029
(.175 ± .074)
.033 ± .017
(.838 ± .432)
°
16HNE
.061 ± .007
(1.549 ± .178)
(1.270 ± .254)
.050 ± .010
(.419 ± ..089)
.3898 ± .0039
(9.901 ± .099)
.0165 ± .0035
(6.00 ± .20)
.236 ± .008
.00865 ± .00115
(.220 ± .029)
Detail A
.1535 ± .0035
(3.899 ± .089)
Top View
Bottom
View
Package Type:
0 to 8
°
Detail A
14HNE
14-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
.0069 ± .0029
(.175 ± .074)
.033 ± .017
(.838 ± .432)
°
.050 ± .010
(1.270 ± .254)
.236 ± .008
(6.00 ± .20)
.0165 ± .0035
(.419 ± ..089)
.3406 ± .0039
(8.651 ± .099)
.00865 ± .00115
(.220 ± .029)
Detail A
.1535 ± .0035
(3.899 ± .089)
Top View
Bottom
View
.280 TYP.
(7.112) TYP.
.110 TYP.
(2.794) TYP.
.280 TYP.
(7.112) TYP.
.110 TYP.
(2.794) TYP.
.061 ± .007
(1.549 ± .178)
Electrically isolated metal
heat sink on bottom of
package
(Connect to any ground or
power plane for optimum
thermal dissipation)
HOLT INTEGRATED CIRCUITS
8
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
Electrically isolated metal
heat sink on bottom of
package
(Connect to any ground or
power plane for optimum
thermal dissipation)