參數(shù)資料
型號: HTCICC6403FUG
廠商: NXP Semiconductors N.V.
元件分類: 通信及網(wǎng)絡(luò)
英文描述: HTCICC64; HITAG ? RO64 transponder IC
封裝: HTCICC6402FUG/AM<Uncased die|<<<1<Always Pb-free,;HTCICC6403FUG/AM<Uncased die|<<<1<Always Pb-free,;
文件頁數(shù): 4/13頁
文件大小: 317K
代理商: HTCICC6403FUG
176431
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 3.1 — 24 July 2009
4 of 13
NXP Semiconductors
HTCICC64
HITAG μ RO64 transponder IC
5.
Pinning information
Table 2.
Note
: All pads except LA and LB are electrically disconnected after dicing.
Fig 2.
HITAG μ RO64 - Mega bumps bondpad locations
HITAG μ RO64 - Mega bumps dimensions
Description
Dimension
(X) chip size
550 μm
(Y) chip size
550 μm
(1) pad center to chip edge
100.5 μm
(2) pad center to chip edge
48.708 μm
(3) pad center to chip edge
180.5 μm
(4) pad center to chip edge
55.5 μm
(5) pad center to chip edge
48.508 μm
(6) pad center to chip edge
165.5 μm
Bump Size:
LA, LB
294
×
164 μm
60
×
60 μm
Remaining pads
001aaj823
(4)
(4)
(3)
(Y)
(X)
(2)
(5)
(6)
(6)
(1)
(1)
LA
LB
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