參數(shù)資料
型號(hào)： HTMS1101FTB
廠商： NXP Semiconductors N.V.
元件分類： 通信及網(wǎng)絡(luò)
英文描述： HITAG ?; Transponder IC
封裝： HTMS1001FTB/AF<sot1122 (XSON3)|<<http://www.nxp.com/packages/sot1122.html<1<Always Pb-free,;HTMS1001FTK/AF<SOT899-1 (HVSON2)|<<http://www.nxp.com/packages/SOT899-1.html&l
文件頁數(shù)： 4/58頁
文件大小： 844K
代理商： HTMS1101FTB
152931
NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.1 — 21 January 2010
152931
4 of 58
NXP Semiconductors
HITAG μ
Transponder IC
3.
Ordering information
Table 1.
Type number
Ordering information
Package
Name
Wafer
Wafer
Description
sawn, megabumped wafer, 150 μm, 8 inch, UV
sawn, megabumped wafer, 150 μm, 8 inch, UV
Type
HITAG
μ
, 210pF
HITAG
μ
advanced,
210pF
HITAG
μ
advanced+,
210pF
HITAG
μ
, 280pF
HITAG
μ
advanced,
280pF
HITAG
μ
advanced+,
280pF
HITAG
μ
, 210pF
Version
-
-
HTMS1001FUG/AM
HTMS1101FUG/AM
HTMS1201FUG/AM
Wafer
sawn, megabumped wafer, 150 μm, 8 inch, UV
-
HTMS8001FUG/AM
HTMS8101FUG/AM
Wafer
Wafer
sawn, megabumped wafer, 150 μm, 8 inch, UV
sawn, megabumped wafer, 150 μm, 8 inch, UV
-
-
HTMS8201FUG/AM
Wafer
sawn, megabumped wafer, 150 μm, 8 inch, UV
-
HTMS1001FTB/AF
XSON3
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
SOT1122
HTMS1101FTB/AF
XSON3
HITAG
μ
advanced,
210pF
HITAG
μ
advanced+,
210pF
HITAG
μ
, 280pF
SOT1122
HTMS1201FTB/AF
XSON3
SOT1122
HTMS8001FTB/AF
XSON3
SOT1122
HTMS8101FTB/AF
XSON3
HITAG
μ
advanced,
280pF
HITAG
μ
advanced+,
280pF
HITAG
μ
, 210pF
SOT1122
HTMS8201FTB/AF
XSON3
SOT1122
HTMS1001FTK/AF
HVSON2
SOT899-1
HTMS1101FTK/AF
HVSON2
HITAG
μ
advanced,
210pF
SOT899-1
HTMS1201FTK/AF
HVSON2
HITAG
μ
advanced+,
210pF
SOT899-1
HTMS8001FTK/AF
HVSON2
HITAG
μ
, 280pF
SOT899-1
HTMS8101FTK/AF
HVSON2
HITAG
μ
advanced,
280pF
SOT899-1
HTMS8201FTK/AF
HVSON2
HITAG
μ
advanced+,
280pF
SOT899-1
相關(guān)PDF資料
PDF描述
HTMS1101FTK HITAG ?; Transponder IC
HTMS1101FUG HITAG ?; Transponder IC
HTMS1201FTB HITAG ?; Transponder IC
HTMS1201FTK HITAG ?; Transponder IC
HTMS1201FUG HITAG ?; Transponder IC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HTMS1101FTB/AF,115 功能描述:RFID應(yīng)答器 RFID HTAG 128BIT MEM RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
HTMS1101FTB/AF115 制造商:NXP Semiconductors 功能描述:LF TAG IC 512 BIT 210PF SOT1122
HTMS1101FTK/AF,115 功能描述:RFID應(yīng)答器 125KHz XSPON MOD-ASK RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
HTMS1101FTK/AF115 制造商:NXP Semiconductors 功能描述:LF TAG IC 512 BIT 210PF HVSON2
HTMS1101FUG/AM,005 功能描述:RFID應(yīng)答器 HITAG transponder IC RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
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