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參數(shù)資料
| 型號(hào)： | HTSH5601ETK |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類(lèi)： | 通信及網(wǎng)絡(luò) |
| 英文描述： | HITAG S transponder IC |
| 封裝： | HTSFCH4801EV/DH<SOT732-1 (FCP2)|<<http://www.nxp.com/packages/SOT732-1.html<1<Always Pb-free,;HTSFCH5601EV/DH<SOT732-1 (FCP2)|<<http://www.nxp.com/packages/SOT732-1.html& |
| 文件頁(yè)數(shù)： | 3/21頁(yè) |
| 文件大?。?/td> | 162K |
| 代理商： | HTSH5601ETK |
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HTSICH56_48_SDS
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 12 October 2011
210330
3 of 21
NXP Semiconductors
HTSICH56; HTSICH48
HITAG S transponder IC
4. Quick reference data
Table 1.
Symbol
Wafer EEPROM characteristics
t
ret
retention time
N
endu(W)
write endurance
Interface characteristics
C
i
input capacitance
[1]
Typical ratings are not guaranteed. Values are at 25
C
.
Measured with Q
coil
= 20, L
coil
= 7.5 mH, optimal tuned to resonance circuit;
V
IN1-IN2
= 2 V (RMS)
[2]
5. Ordering information
[1]
This package is also known as MOA2
Quick reference data
Parameter
Conditions
Min
Typ
[1]
Max
Unit
T
amb
55
C
10
100000
-
-
year
cycle
between IN1 and IN2
HTSICxxxxxEW/x7
[2]
199
210
221
pF
Table 2.
Type number
Ordering information
Package
Name
Wafer
Wafer
Wafer
Memory size
256 bit
2048 bit
256 bit
Description
Au-bumped die on sawn wafer, inkless
Au-bumped die on sawn wafer, inkless
Au-megabumped die on sawn wafer,
inkless
Au-megabumped die on sawn wafer,
inkless
plastic leadless module carrier
package; 35 mm wide tape
plastic leadless module carrier
package; 35 mm wide tape
metal flip chip package; 2 leads;
35 mm wide tape
metal flip chip package; 2 leads;
35 mm wide tape
plastic thermal enhanced very thin
small outline package; no leads;
2 terminals; body 3
2
0.85 mm
plastic thermal enhanced very thin
small outline package; no leads;
2 terminals; body 3
2
0.85 mm
Version
-
-
-
HTSICH5601EW/V7
HTSICH4801EW/V7
HTSICC5601EW/C7
HTSICC4801EW/C7
Wafer
2048 bit
-
HTSMOH5601EV
PLLMC
[1]
256 bit
SOT500-3
HTSMOH4801EV
PLLMC
[1]
2048 bit
SOT500-3
HTSFCH5601EV/DH
FCP2
256 bit
SOT732-1
HTSFCH4801EV/DH
FCP2
2048 bit
SOT732-1
HTSH5601ETK
HVSON2
256 bit
SOT899-1
HTSH4801ETK
HVSON2
2048 bit
SOT899-1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HTSICC4801EW | HITAG S transponder IC |
| HTSICC5601EW | HITAG S transponder IC |
| HTSICH4801EW | HITAG S transponder IC |
| HTSICH5601EW | HITAG S transponder IC |
| HTSMOH4801EV | HITAG S transponder IC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HTSH5601ETK,118 | 功能描述:RFID應(yīng)答器 HTSH5601ETK/HVSON2/R RoHS:否 制造商:Murata 存儲(chǔ)容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| HTSH5601ETK118 | 制造商:NXP Semiconductors 功能描述:LF TAG IC 256BIT 210PF HVSON2 |
| HTSHC-105-S-22-640-G-LT-LF | 制造商:Major League Electronics 功能描述:5 Position Single Row 2.54 mm Through-Hole Connector |
| HTSHC-505-D-08-290-GT | 制造商:Major League Electronics 功能描述:TSHC-5-D Series 5 Position Dual Row 10 Microinch Gold Terminal Strip Header |
| HTSHR-108-D-04-B-T-LF | 制造商:Major League Electronics 功能描述:HTSHR Series 2.54 mm Pitch 8 Position Dual Row Shrouded Header |
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