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IBIS4-6600
Datasheet
4
Cypress Semiconductor Corporation
Contact: info@Fillfactory.com Document #: 38-05708 Rev.**(Revision 1.3 ) Page 3 of 63
3901 North First Street
San Jose, CA 95134
408-943-2600
TIMING DIAGRAMS .........................................................................................39
4.1
4.2
4.3
S
EQUENCER CONTROL SIGNALS
......................................................................39
B
ASIC FRAME AND LINE TIMING
.....................................................................39
P
IXEL OUTPUT TIMING
....................................................................................40
4.3.1
Two outputs............................................................................................40
4.3.2
Multiplexing to one output.....................................................................41
4.3.3
ADC timing ............................................................................................42
5
PIN LIST..............................................................................................................43
N
OTE ON POWER
-
ON BEHAVIOR
.................................................................................45
6
PAD POSITIONING AND PACKAGING..........................................................47
6.1
6.2
B
ARE DIE
........................................................................................................47
B
ONDING PADS
...............................................................................................48
6.2.1
Probe pad positions...............................................................................48
6.2.2
Bonding pad positions............................................................................49
6.3
P
ACKAGE DRAWING
.......................................................................................51
6.3.1
Technical drawing of the 68-pins LCC package....................................51
6.3.2
Bonding of the IBIS4-6600 sensor in the 68-pins LCC package...........54
6.4
G
LASS LID SPECIFICATIONS
............................................................................55
6.4.1
Color sensor...........................................................................................55
6.4.2
Monochrome sensor...............................................................................56
7
BOUNDARY SCAN TEST STRUCTURES.......................................................57
8
STORAGE AND HANDLING............................................................................58
8.1
8.2
S
TORAGE CONDITIONS
....................................................................................58
H
ANDLING AND SOLDER PRECAUTIONS
..........................................................58
9
ORDERING INFORMATION.............................................................................60
APPENDIX A: IBIS4 EVALUATION KIT................................................................62