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參數(shù)資料
| 型號： | IBM42F10SNNAA20 |
| 廠商： | IBM Microeletronics |
| 英文描述： | SFF-1063/1250N-SW PTH Serial Optical Transceiver(SFF-1063/1250N-SW PTH串行光纖收發(fā)器) |
| 中文描述： | SFF-1063/1250N-SW普通話系列光收發(fā)器（SFF-1063/1250N-SW普通話串行光纖收發(fā)器） |
| 文件頁數(shù)： | 5/7頁 |
| 文件大?。?/td> | 465K |
| 代理商： | IBM42F10SNNAA20 |
Application Note
SFF-1063/1250N-SW PTH Serial Optical Transceiver Design & Layout Guide
optxcvr.fm
July 2000
Page 5
Power Isolation
Transceiver Power Island
To reduce jitter and crosstalk through the power
supply, a separate power island should be used to
supply the transceiver. To create the island, power
from Vcc should be fed through a pi-network LC filter
consisting of a 1
μ
H series inductor and a capacitor
network on either side of the inductor connected to
the PC board ground plane. The capacitor network
consists of a parallel combination of one 0.01
μ
F
ceramic and one 10
μ
F tantalum capacitor. Capaci-
tors should be surface-mount, however components
with extremely short leads may be used.
SERDES Power Islands
Some SERDES modules provide separate power
pins for the transmit and receive phase locked loop
circuits and the remainder of the module electronics.
Each of these power domains should be isolated
from the Vcc supply using the pi-network isolation
method described in the previous paragraph.
Depending on the host PC board layout and power
supply characteristics, more high frequency
(ceramic) and/or mid frequency (tantalum) bypass
capacitors may be required. To increase capaci-
tance, several capacitors should be paralleled rather
than using a single large-value component to mini-
mize inductance and ESR.
Logic Connections
The low speed Tx_Disable input and Rx_LOS output
lines to and from the transceiver are open collector
and TTL-compatible. RC deglitching should be used
on the Tx_Disable line to desensitize it from electri-
cal noise. Each connection of the high speed
Tx_DAT+/Tx_DAT- and Rx_DAT+/Rx_DAT- differ-
ential line pairs between the transceiver and the
SERDES module should be decoupled with a
0.01
μ
F capacitor. These lines have no series DC
decoupling capacitors inside the transceiver module.
Mechanical
Some mechanical force is required to connect and
disconnect optical fiber cables from the enclosure
box. Because this can exert mechanical forces on
the host PC board, the transceiver-to-PC board and
PC board-to-chassis mountings must be designed to
handle the additional stress.
Cooling
The transceiver
’
s power dissipation is quite low, but
it is not zero. Because the transceiver package is
small, some air flow around the device is required to
maintain acceptable operating temperatures. Con-
vection cooling may be used only when enough
space exists around the transceiver to permit suffi-
cient air flow.
Manufacturing Process
Because the transceiver is a non-wettable compo-
nent, it must be soldered to the host PC board using
a washless flux for both wave solder and hand sol-
der processes. The protective cover shipped with
the transceiver should not be removed during manu-
facturing assembly processes, otherwise dust and
evaporative matter could contaminate the optical
assemblies.
Reasonable care should taken to not expose the
transceiver to ESD conditions during handling and
particularly when inserting the device into the host
PC board. The transceiver should be left in its con-
ductive plastic packing until insertion, which should
be done only under ESD-controlled conditions. Par-
ticular care must be taken in low-humidity environ-
ments.
Because of the very close tolerances required to
mesh with the front bezel, it will probably be neces-
sary to fixture all SFF transceiver modules during
the host PC board soldering process.
Laser Safety
The optical laser used in the transceiver is a Class 1
laser-safe product. Monitoring and control circuits
inside the transceiver help to ensure safe laser oper-
ation. However, the Class 1 safety rating is valid
only when the host power supply Vcc remains below
4Vdc. Therefore, to ensure Class 1 safety operation
of the laser, the Tx Power voltage must not exceed
4Vdc. The host power electronics must provide
overvoltage protection to prevent Tx Power from
exceeding 4Vdc.
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