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參數(shù)資料
| 型號： | IBMN325804CT3 |
| 廠商： | IBM Microeletronics |
| 英文描述： | 256Mb（8Mbit x 8 I/O x 4 Bank） Synchronous DRAM(256M位（8M位 x 8 I/O x 4 組）同步動態(tài)RAM) |
| 中文描述： | 256Mb的（8Mbit × 8的I / O × 4行）同步DRAM（256M位（800萬位× 8的I / O × 4組）同步動態(tài)RAM）的 |
| 文件頁數(shù)： | 1/66頁 |
| 文件大?。?/td> | 1699K |
| 代理商： | IBMN325804CT3 |
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IBMN325164CT3 IBMN325804CT3
IBMN325404CT3
Preliminary
256Mb Synchronous DRAM - Die Revision B
06K0608.F39375A
10/00
IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
Page 1 of 66
Features
High Performance:
Single Pulsed RAS Interface
Fully Synchronous to Positive Clock Edge
Four Banks controlled by BA0/BA1
(Bank Select)
Programmable CAS Latency: 2, 3
Programmable Burst Length: 1, 2, 4, 8
Programmable Wrap: Sequential or Interleave
Multiple Burst Read with Single Write Option
Automatic and Controlled Precharge Command
Data Mask for Read/Write control (x4, x8)
Dual Data Mask for byte control (x16)
Auto Refresh (CBR) and Self Refresh
Suspend Mode and Power Down Mode
Standard Power operation
8192 refresh cycles/64ms
Random Column Address every CK (1-N Rule)
Single 3.3V
±
0.3V Power Supply
LVTTL compatible
Package: 54-pin 400 mil TSOP-Type II
Description
The IBM0325404CT3, IBM0325804CT3, and
IBM0325164CT3 are four-bank Synchronous
DRAMs organized as 16Mbit x 4 I/O x 4 Bank, 8Mbit
x 8 I/O x 4 Bank, and 4Mbit x 16 I/O x 4 Bank,
respectively. These synchronous devices achieve
high-speed data transfer rates of up to 133MHz by
employing a pipeline chip architecture that synchro-
nizes the output data to a system clock. The chip is
fabricated with IBM’s advanced 256Mbit single tran-
sistor CMOS DRAM process technology.
The device is designed to comply with all JEDEC
standards set for synchronous DRAM products,
both electrically and mechanically. All of the control,
address, and data input/output (I/O or DQ) circuits
are synchronized with the positive edge of an exter-
nally supplied clock.
RAS, CAS, WE, and CS are pulsed signals which
are examined at the positive edge of each externally
applied clock (CK). Internal chip operating modes
are defined by combinations of these signals and a
command decoder initiates the necessary timings
for each operation. A fifteen bit address bus accepts
address data in the conventional RAS/CAS multi-
plexing style. Thirteen row addresses (A0-A12) and
two bank select addresses (BA0, BA1) are strobed
with RAS. Eleven column addresses (A0-A9, A11)
plus bank select addresses and A10 are strobed
with CAS. Column address A11 is dropped on the
x8 device, and column addresses A11 and A9 are
dropped on the x16 device.
Prior to any access operation, the CAS latency,
burst length, and burst sequence must be pro-
grammed into the device by address inputs A0-A12,
BA0, BA1 during a mode register set cycle. In addi-
tion, it is possible to program a multiple burst
sequence with single write cycle for write through
cache operation.
Operating the four memory banks in an interleave
fashion allows random access operation to occur at
a higher rate than is possible with standard DRAMs.
A sequential and gapless data rate of up to 133MHz
is possible depending on burst length, CAS latency,
and speed grade of the device. Auto Refresh (CBR)
and Self Refresh operation are supported.
-75H
3
CL=2
-75D
3
CL=3
-75A,
CL=3
-260,
CL=2
-360,
CL=3
-10,
f
CK
Clock
Frequency
133
133
133
100
100
100
MHz
t
CK
Clock Cycle
Clock Access
Time
7.5
7.5
7.5
10
10
10
ns
t
AC
—
—
—
—
—
7
ns
t
AC
Clock Access
Time
2
5.4
5.4
5.4
6
6
9
ns
1. Terminated load. See AC Characteristics on page 37.
2. Unterminated load. See AC Characteristics on page 37.
3. t
RP
= t
RCD
= 2 CKs
.
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