參數(shù)資料
型號: IBMN325804CT3
廠商: IBM Microeletronics
英文描述: 256Mb(8Mbit x 8 I/O x 4 Bank) Synchronous DRAM(256M位(8M位 x 8 I/O x 4 組)同步動態(tài)RAM)
中文描述: 256Mb的(8Mbit × 8的I / O × 4行)同步DRAM(256M位(800萬位× 8的I / O × 4組)同步動態(tài)RAM)的
文件頁數(shù): 15/66頁
文件大?。?/td> 1699K
代理商: IBMN325804CT3
IBMN325164CT3
IBMN325804CT3
IBMN325404CT3
Preliminary
256Mb Synchronous DRAM - Die Revision B
06K0608.F39375A
10/00
IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
Page 15 of 66
Write Interrupted by a Read
A Read Command will interrupt a burst write operation on the same clock cycle that the Read Command is
registered. The DQs must be in the high impedance state at least one cycle before the interrupting read data
appears on the outputs to avoid data contention. When the Read Command is registered, any residual data
from the burst write cycle will be ignored. Data that is presented on the DQ pins before the Read Command is
initiated will actually be written to the memory.
Minimum Write to Read Interval
COMMAND
NOP
WRITE A
READ B
NOP
NOP
NOP
NOP
NOP
NOP
t
CK2
,
DQs
CAS latency = 2
DIN A
0
t
CK3
,
DQs
CAS latency = 3
DIN A
0
CK
T0
T2
T1
T3
T4
T5
T6
T7
T8
Input data for the Write is masked.
Input data must be removed from the DQs at least one clock
cycle before the Read data appears on the outputs to avoid
data contention.
DOUT B
0
DOUT B
1
DOUT B
2
DOUT B
3
DOUT B
0
DOUT B
1
DOUT B
2
DOUT B
3
(Burst Length = 4, CAS latency = 2, 3)
: “H” or “L”
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