參數(shù)資料
型號: K4B1G1646C-CF8
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 1Gb C-die DDR3 SDRAM Specification
中文描述: 1Gb的?芯片的DDR3 SDRAM規(guī)范
文件頁數(shù): 7/63頁
文件大小: 1255K
代理商: K4B1G1646C-CF8
Page 7 of 63
Rev. 1.0 June 2007
1Gb DDR3 SDRAM
K4B1G04(08/16)46C
1
2
3
4
5
6
7
8
9
10
11
A
B
NC
NC
NC
NC
NC
NC
C
D
NC
VDDQ
DQU5
DQU7
DQU4
VDDQ
VSS
NC
D
E
F
VSSQ
VDDQ
VDD
DQU3
VSS
DQU1
DQSU
DQSU
DQU6
DQU2
VSSQ
VDDQ
E
F
G
H
VSSQ
VSS
VDDQ
VSSQ
DMU
DQL0
DQU0
DML
VSSQ
VSSQ
VDD
VDDQ
G
H
J
K
VDDQ
VSSQ
DQL2
DQL6
DQSL
DQSL
DQL1
VDD
DQL3
VSS
VSSQ
VSSQ
J
K
L
M
VREFDQ
NC
VDDQ
VSS
DQL4
RAS
DQL7
CK
DQL5
VSS
VDDQ
NC
L
M
N
P
ODT
NC
VDD
CS
CAS
WE
CK
VDD
ZQ
CKE
NC
N
P
A10/AP
R
VSS
BA0
BA2
A15
VREFCA
VSS
R
T
U
VDD
VSS
A3
A5
A0
A2
A12/BC
A1
BA1
A4
VDD
VSS
T
U
V
W
VDD
VSS
A7
A9
A13
A11
NC
A6
A8
VDD
VSS
V
W
NC
RESET
NC
Y
AA
AB
NC
NC
NC
NC
NC
NC
Note1: A1,A2,A4,A8,A10,A11,D1,D11,W1,W11,AB1,AB2,AB4,AB8,AB10 and AB11 balls indicate mechanical support balls with no internal connection
Populated ball
Ball not populated
Ball Locations (x16)
Top view
(See the balls through the Package)
1
2
3
4
8
9
5
6
7
A
B
C
D
E
F
G
H
J
K
L
N
M
10 11
P
R
T
U
V
W
Y
AA
AB
3.3 x16 Package Pinout (Top view) : 112ball FBGA Package
(96balls + 16 balls of support balls)
相關(guān)PDF資料
PDF描述
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K4C560838C-TCD4 Aluminum Electrolytic Radial Lead High Ripple, Long Life Capacitor; Capacitance: 150uF; Voltage: 200V; Case Size: 16x31.5 mm; Packaging: Bulk
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