參數(shù)資料
型號: K4N51163QC-ZC25
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: ; Filter Type:RFI; Current Rating:180A; Voltage Rating:480V; Series:FN258 RoHS Compliant: Yes
中文描述: 512MB的GDDR2 SDRAM的
文件頁數(shù): 46/64頁
文件大?。?/td> 1420K
代理商: K4N51163QC-ZC25
- 46 -
Rev 1.5 Oct. 2005
512M gDDR2 SDRAM
K4N51163QC-ZC
Minimum Write to Precharge Command spacing to the same bank = WL + BL/2 clks + tWR For write cycles, a delay must be satisfied
from the completion of the last burst write cycle until the Precharge Command can be issued. This delay is known as a write recovery
time (tWR) referenced from the completion of the burst write to the precharge command. No Precharge command should be issued
prior to the tWR delay.
Example 1 : Burst Write followed by Precharge: WL = (RL-1) =3, BL=4
Example 2 : Burst Write followed by Precharge: WL = (RL-1) = 4, BL=4
CMD
DQs
CK/CK
T0
T2
T1
T3
T4
T5
T6
T7
T 8
WL = 3
DQS
> = t
WR
CMD
NOP
NOP
NOP
NOP
NOP
NOP
DQs
NOP
CK/CK
T0
T2
T1
T3
T4
T5
T6
T7
T 9
DIN A
0
DIN A
1
DIN A
2
DIN A
3
WRITE A
Posted CAS
WL = 4
DQS
> = t
WR
Precharge A
Completion of the Burst Write
NOP
NOP
NOP
NOP
NOP
NOP
NOP
WRITE A
Posted CAS
Precharge A
Completion of the Burst Write
DIN A
0
DIN A
1
DIN A
2
DIN A
3
Burst Write followed by Precharge
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