參數資料
型號: K4R881869M-NbCcG6
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 288Mbit RDRAM 512K x 18 bit x 2*16 Dependent Banks Direct RDRAMTM
中文描述: 288Mbit RDRAM的為512k × 18位× 2 * 16屬銀行直接RDRAMTM
文件頁數: 4/64頁
文件大?。?/td> 4084K
代理商: K4R881869M-NBCCG6
Page 2
Direct RDRAM
K4R881869M
Rev. 0.9 Jan. 2000
Preliminary
The pin #1(ROW 1, COL A) is located at the
A1 position on the top side and the A1 position
is marked by the marker
.
Pinouts and Definitions
Center-Bonded Devices - Preliminary
These tables shows the pin assignments of the center-bonded
RDRAM package. The mechanical dimensions of this
package are shown in a later section. Refer to Section
Center-Bonded uBGA Package
on page 58. Note - pin #1
is at the A1 position. .
Table 1: Center-Bonded Device (top view)
10
V
DD
GND
V
DD
GND
V
DD
V
DD
V
DD
V
DD
GND
V
DD
9
8
GND
V
DD
CMD
V
DD
GND
GNDa
GNDa
V
DD
V
DD
GND
GND
V
DD
V
DD
GND
GND
V
CMOS
V
DD
GND
7
V
DD
DQA8
DQA7
DQA5
DQA3
DQA1
CTMN
CTM
RQ7
RQ5
RQ3
RQ1
DQB1
DQB3
DQB5
DQB7
DQB8
V
DD
6
5
4
GND
GND
DQA6
DQA4
DQA2
DQA0
CFM
CFMN
RQ6
RQ4
RQ2
RQ0
DQB0
DQB2
DQB4
DQB6
GND
GND
3
V
DD
GND
SCK
V
CMOS
GND
V
DD
GND
V
DDa
V
REF
GND
V
DD
GND
GND
V
DD
SIO0
SIO1
GND
V
DD
2
1
V
DD
GND
GND
V
DD
GND
GND
GND
GND
GND
V
DD
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
T
U
COL
ROW
Chip
Top View
K4R88
xx
69A-
N
xxx
SAMSUNG 001
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