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參數(shù)資料
| 型號： | K4S513233F-MC |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | Mobile SDRAM |
| 中文描述： | 移動SDRAM |
| 文件頁數(shù)： | 1/12頁 |
| 文件大?。?/td> | 143K |
| 代理商： | K4S513233F-MC |
K4S513233F - M(E)C/L/F
September 2004
1
Mobile SDRAM
3.0V & 3.3V power supply.
LVCMOS compatible with multiplexed address.
Four banks operation.
MRS cycle with address key programs.
-. CAS latency (1, 2 & 3).
-. Burst length (1, 2, 4, 8 & Full page).
-. Burst type (Sequential & Interleave).
EMRS cycle with address key programs.
All inputs are sampled at the positive going edge of the system
clock.
Burst read single-bit write operation.
Special Function Support.
-. PASR (Partial Array Self Refresh).
-. Internal TCSR (Temperature Compensated Self Refresh)
DQM for masking.
Auto refresh.
64ms refresh period (8K cycle).
Commercial Temperature Operation (-25
°
C ~ 70
°
C).
2Chips DDP 90Balls FBGA ( -MXXX -Pb, -EXXX -Pb Free).
FEATURES
The K4S513233F is 536,870,912 bits synchronous high data
rate Dynamic RAM organized as 4 x 4,196,304 words by 32 bits,
fabricated with SAMSUNG’s high performance CMOS technol-
ogy. Synchronous design allows precise cycle control with the
use of system clock and I/O transactions are possible on every
clock cycle. Range of operating frequencies, programmable
burst lengths and programmable latencies allow the same
device to be useful for a variety of high bandwidth and high per-
formance memory system applications.
GENERAL DESCRIPTION
ORDERING INFORMATION
- M(E)C/L/F : Normal / Low / Low Power, Commercial Temperature(-25
°
C ~ 70
°
C)
NOTES :
1. In case of 40MHz Frequency, CL1 can be supported.
2. Samsung shall not offer for sale or sell either directly or through and third-party proxy, and DRAM memory products that include "Multi-Die Plastic
DRAM" for use as components in general and scientific computers such as, by way of example, mainframes, servers, work stations or desk top
computers for the first three years of five year term of this license. Nothing herein limits the rights of Samsung to use Multi-Die Plastic DRAM in other
products or other applications under paragrangh such as mobile, telecom or non-computer application(which include by way of example laptop or
notebook computers, cell phones, televisions or visual monitors)
Violation may subject the customer to legal claims and also excludes any warranty against infringement from Samsung." .
3. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.
Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific pur
pose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.
Part No.
Max Freq.
Interface
Package
K4S513233F-M(E)C/L/F75
133MHz(CL=3), 111MHz(CL=2)
LVCMOS
90 FBGA Pb
(Pb Free)
K4S513233F-M(E)C/L/F1H
111MHz(CL=2)
K4S513233F-M(E)C/L/F1L
111MHz(CL=3)*1, 83MHz(CL2)
4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
相關PDF資料 |
PDF描述 |
|---|---|
| K4S513233F | Mobile SDRAM |
| K4S513233F-L | Mobile SDRAM |
| K4S51323L | 4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA |
| K4S51323LF-F1H | 4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA |
| K4S51323LF-F75 | 4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| K4S513233F-ML1LT00 | 制造商:Samsung Semiconductor 功能描述:DRAM CHIP MOBILE SDRAM 512MBIT 3.3V 90FBGA - Tape and Reel |
| K4S51323L | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA |
| K4S51323LF-F1H | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA |
| K4S51323LF-F1L | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA |
| K4S51323LF-F75 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA |
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