參數(shù)資料
型號(hào): K6X0808T1D-GF70
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 32Kx8 bit Low Power CMOS Static RAM
中文描述: 32Kx8位低功耗CMOS靜態(tài)RAM
文件頁數(shù): 4/9頁
文件大?。?/td> 153K
代理商: K6X0808T1D-GF70
CMOS SRAM
K6X0808T1D Family
Revision 1.0
December 2003
4
RECOMMENDED DC OPERATING CONDITIONS
1)
Note:
1. Industrial Product: T
A
=-40 to 85
°
C, Otherwise specified
A
utomotive Product: T
A
=-40 to 125
°
C, Otherwise specified
2. Overshoot: Vcc+3.0V in case of pulse width
30ns.
3. Undershoot: -3.0V in case of pulse width
30ns.
4. Overshoot and undershoot are sampled, not 100% tested.
Item
Symbol
Min
Typ
Max
Unit
Supply voltage
Vcc
2.7
3.0/3.3
3.6
V
Ground
Vss
0
0
0
V
Input high voltage
V
IH
2.2
-
Vcc+0.2
2)
0.6
V
Input low voltage
V
IL
-0.2
3)
-
V
CAPACITANCE
1
)
(f=1MHz, TA=25
°
C)
1. Capacitance is sampled, not 100% tested
Item
Symbol
Test Condition
Min
Max
Unit
Input capacitance
C
IN
V
IN
=0V
-
8
pF
Input/Output capacitance
C
IO
V
IO
=0V
-
10
pF
DC AND OPERATING CHARACTERISTICS
Item
Symbol
Test Conditions
Min
Typ Max Unit
Input leakage current
I
LI
V
IN
=Vss to Vcc
-1
-
1
μ
A
Output leakage current
I
LO
CS=V
IH
or OE=V
IH
or WE=V
IL
, V
IO
=V
SS
to Vcc
-1
-
1
μ
A
Operating power supply current
I
CC
I
IO
=0mA, CS=V
IL,
V
IN
=V
IH
or V
IL
, Read
-
-
2
mA
Average operating current
I
CC1
Cycle time=1
μ
s, 100% duty, I
IO
=0mA, CS
0.2V,
V
IN
0.2V
IN
Vcc -0.2V
-
-
3
mA
I
CC2
Cycle time=Min,100% duty, I
IO
=0mA, CS=V
IL,
V
IN
=V
IH
or V
IL
-
-
20
mA
Output low voltage
V
OL
I
OL
=2.1mA
-
-
0.4
V
Output high voltage
V
OH
I
OH
=-1.0mA
2.4
-
-
V
Standby Current(TTL)
I
SB
CS=V
IH
, Other inputs=V
IH
or V
IL
-
-
0.3
mA
Standby Current(CMOS)
I
SB1
CS
Vcc-0.2V, Other inputs=0~Vcc
K6X0808T1D-F
-
-
6
μ
A
μ
A
K6X0808T1D-Q
-
-
10
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