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K6X8016T3B Family
Revision 1.0
September 2003
2
CMOS SRAM
512Kx16 bit Low Power Full CMOS Static RAM
GENERAL DESCRIPTION
The K6X8016T3B families are fabricated by SAMSUNG
′
s
advanced full CMOS process technology. The families support
various operating temperature range for user flexibility of sys-
tem design. The families also support low data retention voltage
for battery back-up operation with low data retention current.
FEATURES
Process Technology: Full CMOS
Organization: 512K x16
Power Supply Voltage: 2.7~3.6V
Low Data Retention Voltage: 1.5V(Min)
Three state outputs
Package Type: 44-TSOP2-400F
Name
Function
Name
Function
CS
Chip Select Input
Vcc
Power
OE
Output Enable Input
Vss
Ground
WE
Write Enable Input
UB
Upper Byte(I/O
9
~
16
)
A
0
~A
18
Address Inputs
LB
Lower Byte(I/O
1
~
8
)
I/O
1
~I/O
16
Data Inputs/Outputs
PRO
DUCT FAMILY
1. This parameter is measured with 50pF test load (Vcc=3.0~3.6V).
Product Family
Operating Temperature
Vcc Range
Speed
Power Dissipation
PKG Type
Standby
(I
SB1
, Max)
15
μ
A
25
μ
A
Operating
(I
CC2
, Max)
K6X8016T3B-F
Industrial(-40~85
°
C)
Automotive(-40~125
°
C)
2.7~3.6V
55
1)
/70ns
30mA
44-TSOP2-400F
K6X8016T3B-Q
70ns
SAMSUNG ELECTRONICS CO., LTD.
reserves the right to change products and specifications without notice.
FUNCTIONAL BLOCK DIAGRAM
Clk gen.
Row
select
I/O
1
~I/O
8
Data
cont
Data
cont
Data
cont
I/O
9
~I/O
16
Vcc
Vss
Precharge circuit.
Memory array
1024 rows
512
×
16 columns
I/O Circuit
Column select
PIN DESCRIPTION
WE
OE
UB
CS
LB
Control Logic
Row
Addresses
Column Addresses
A4
A3
A2
A1
A0
CS
I/OI
I/O2
I/O3
I/O4
Vcc
Vss
I/O5
I/O6
I/O7
I/O8
WE
A18
A17
A16
A15
A14
A5
A6
A7
OE
UB
LB
I/O16
I/O15
I/O14
I/O13
Vss
Vcc
I/O12
I/O11
I/O10
I/O9
A8
A9
A10
A11
A12
44-TSOP2
Forward
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
A13