型號: | K7D803671B-HC37 |
廠商: | SAMSUNG SEMICONDUCTOR CO. LTD. |
英文描述: | 256Kx36 & 512Kx18 SRAM |
中文描述: | 256Kx36 |
文件頁數(shù): | 11/16頁 |
文件大?。?/td> | 270K |
代理商: | K7D803671B-HC37 |
相關(guān)PDF資料 |
PDF描述 |
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K7I321882M | 1Mx36 & 2Mx18 DDRII CIO b2 SRAM |
K7I323682M | 1Mx36 & 2Mx18 DDRII CIO b2 SRAM |
K7J161882B | 512Kx36 & 1Mx18 DDR II SIO b2 SRAM |
K7J163682B | 512Kx36 & 1Mx18 DDR II SIO b2 SRAM |
K7J321882M | 1Mx36 & 2Mx18 DDR II SIO b2 SRAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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K7FU12 | 制造商:3M Electronic Products Division 功能描述:SPP3 TRAY KIT FOR 12 FUSION SPLICES |
K7-H5 | 制造商:MITSUMI 制造商全稱:Mitsumi Electronics, Corp. 功能描述:Adjustable Type Coils |
K7H803654C-FC16T00 | 制造商:Samsung Semiconductor 功能描述:8MB 8MSYNC DOUBLE DATA RATE X36 BGA - Tape and Reel |
K7I161882B | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Kx36 & 1Mx18 DDRII CIO b2 SRAM |
K7I161882B-FC16 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Kx36-bit, 1Mx18-bit DDRII CIO b2 SRAM |