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參數(shù)資料
| 型號： | K7M161825M |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | 512Kx36 & 1Mx18 Flow-Through NtRAM-TM |
| 中文描述： | 512Kx36 |
| 文件頁數(shù)： | 12/20頁 |
| 文件大?。?/td> | 364K |
| 代理商： | K7M161825M |
512Kx36 & 1Mx18 Flow-Through N
t
RAM
TM
- 12 -
Rev 3.0
February 2001
K7M161825M
K7M163625M
AC TIMING CHARACTERISTICS
(V
DD
=3.3V+0.165V/-0.165V, T
A
=0
°
C to +70
°
C)
Notes :
1. All address inputs must meet the specified setup and hold times for all rising clock(CLK) edges when ADV is sampled low and CS is sampled
low. All other synchronous inputs must meet the specified setup and hold times whenever this device is chip selected.
2. Chip selects must be valid at each rising edge of CLK(when ADV is Low) to remain enabled.
3. A write cycle is defined by WE low having been registerd into the device at ADV Low, A Read cycle is defined by WE High with ADV Low,
Both cases must meet setup and hold times.
4. To avoid bus contention, At a given vlotage and temperature t
LZC
is more than t
HZC.
The soecs as shown do not imply bus contention because t
LZC
is a Min. parameter that is worst case at totally different test conditions
(0
°
C,3.465V) than t
HZC
, which is a Max. parameter(worst case at 70
°
C,3.135V)
It is not possible for two SRAMs on the same board to be at such different voltage and temperatue.
PARAMETER
SYMBOL
-75
-85
-90
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
Cycle Time
t
CYC
8.5
-
10
-
10
-
ns
Clock Access Time
t
CD
-
7.5
-
8.5
-
9.0
ns
Output Enable to Data Valid
t
OE
-
4.0
-
4.0
-
4.0
ns
Clock High to Output Low-Z
t
LZC
2.5
-
2.5
-
2.5
-
ns
Output Hold from Clock High
t
OH
2.5
-
2.5
-
2.5
-
ns
Output Enable Low to Output Low-Z
t
LZOE
0
-
0
-
0
-
ns
Output Enable High to Output High-Z
t
HZOE
-
4.0
-
4.0
-
4.0
ns
Clock High to Output High-Z
t
HZC
-
5.0
-
5.0
-
5.0
ns
Clock High Pulse Width
t
CH
2.5
-
3.0
-
3.0
-
ns
Clock Low Pulse Width
t
CL
2.5
-
3.0
-
3.0
-
ns
Address Setup to Clock High
t
AS
2.0
-
2.0
-
2.0
-
ns
CKE Setup to Clock High
t
CES
2.0
-
2.0
-
2.0
-
ns
Data Setup to Clock High
t
DS
2.0
-
2.0
-
2.0
-
ns
Write Setup to Clock High (WE, BW
X
)
t
WS
2.0
-
2.0
-
2.0
-
ns
Address Advance Setup to Clock High
t
ADVS
2.0
-
2.0
-
2.0
-
ns
Chip Select Setup to Clock High
t
CSS
2.0
-
2.0
-
2.0
-
ns
Address Hold from Clock High
t
AH
0.5
-
0.5
-
0.5
-
ns
CKE Hold from Clock High
t
CEH
0.5
-
0.5
-
0.5
-
ns
Data Hold from Clock High
t
DH
0.5
-
0.5
-
0.5
-
ns
Write Hold from Clock High (WE, BW
X
)
t
WH
0.5
-
0.5
-
0.5
-
ns
Address Advance Hold from Clock High
t
ADVH
0.5
-
0.5
-
0.5
-
ns
Chip Select Hold from Clock High
t
CSH
0.5
-
0.5
-
0.5
-
ns
ZZ High to Power Down
t
PDS
2
-
2
-
2
-
cycle
ZZ Low to Power Up
t
PUS
2
-
2
-
2
-
cycle
Output Load(B),
(for t
LZC
, t
LZOE
, t
HZOE
& t
HZC
)
Dout
353
/
1538
5pF*
+3.3V for 3.3V I/O
/+2.5V for 2.5V I/O
319
/
1667
Fig. 1
* Including Scope and Jig Capacitance
Output Load(A)
Dout
Zo=50
RL=50
VL=1.5V for 3.3V I/O
V
DDQ
/2 for 2.5V I/O
30pF*
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