參數(shù)資料
型號: K9F5616U0C-HIB0
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 512Mb/256Mb 1.8V NAND Flash Errata
中文描述: 512Mb/256Mb 1.8 NAND閃存勘誤表
文件頁數(shù): 22/39頁
文件大?。?/td> 655K
代理商: K9F5616U0C-HIB0
K9F5616U0C-YCB0,YIB0,PCB0,PIB0
K9F5616U0C-DCB0,DIB0,HCB0,HIB0
FLASH MEMORY
21
K9F5608U0C-YCB0,YIB0,PCB0,PIB0
K9F5608U0C-DCB0,DIB0,HCB0,HIB0
K9F5608Q0C-DCB0,DIB0,HCB0,HIB0
K9F5616Q0C-DCB0,DIB0,HCB0,HIB0
K9F5608U0C-VCB0,VIB0,FCB0,FIB0
t
CHZ
t
OH
* Status Read Cycle
CE
WE
CLE
RE
I/Ox
70h
Status Output
t
CLR
t
CLH
t
CS
t
WP
t
CH
t
DS
t
DH
t
REA
t
IR
t
OH
t
OH
t
WHR1
t
CEA
t
CLS
READ1 OPERATION
(READ ONE PAGE)
CE
CLE
R/B
WE
ALE
RE
Busy
Read
CMD
A0~A7
A9~A16
A17~A24
Dout N
Dout N+1
Dout N+2
Dout N+3
Column
Address
Page(Row)
Address
t
WB
t
AR
t
R
t
RC
t
RR
Dout m
t
WC
X8 device : m = 528 , Read CMD = 00h or 01h
X16 device : m = 264 , Read CMD = 00h
t
RHZ
t
OH
t
CEH
t
RB
t
CRY
N Address
1)
1)
NOTES
: 1) is only valid
on K9F5608U0C_Y,P or K9F5608U0C_V,F
I/Ox
On K9F5608U0C_Y,P or K9F5608U0C_V,F
CE must be held
low during tR
t
RHZ
t
CHZ
相關(guān)PDF資料
PDF描述
K9F5616U0C-PCB0 512Mb/256Mb 1.8V NAND Flash Errata
K9F5616U0C-PIB0 512Mb/256Mb 1.8V NAND Flash Errata
K9F5616U0C-YCB0 512Mb/256Mb 1.8V NAND Flash Errata
K9F5616U0C-YIB0 512Mb/256Mb 1.8V NAND Flash Errata
K9F1208Q0A Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; Number of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
K9F5616U0C-P 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 8 Bit 16M x 16 Bit NAND Flash Memory
K9F5616U0C-PCB0 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mb/256Mb 1.8V NAND Flash Errata
K9F5616U0C-PCB0000 制造商:Samsung Semiconductor 功能描述:
K9F5616U0C-PIB0 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mb/256Mb 1.8V NAND Flash Errata
K9F5616U0C-Y 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:32M x 8 Bit , 16M x 16 Bit NAND Flash Memory