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參數(shù)資料
| 型號： | KBE00G003M-D411 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | NAND 512Mb*2 + Mobile SDRAM 256Mb*2 |
| 中文描述： | NAND閃存的512Mb * 2移動SDRAM 256Mb的* 2 |
| 文件頁數(shù)： | 18/89頁 |
| 文件大?。?/td> | 1238K |
| 代理商： | KBE00G003M-D411 |
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KBE00G003M-D411
MCP MEMORY
July 2005
18
Revision 0.1
NAND Flash Technical Notes
(Continued)
Program Flow Chart
Start
I/O 6 = 1
or R/B = 1
I/O 0 = 0
No
*
Write 80h
Write Address
Write Data
Write 10h
Read Status Register
Program Completed
Program Error
Yes
No
Yes
Error in write or read operation
Within its life time, additional invalid blocks may develop with NAND Flash memory. Refer to the qualification report for the block
failure rate.The following possible failure modes should be considered to implement a highly reliable system. In the case of status
read failure after erase or program, block replacement should be done. Because program status fail during a page program does not
affect the data of the other pages in the same block, block replacement can be executed with a page-sized buffer by finding an erased
empty block and reprogramming the current target data and copying the rest of the replaced block. In case of Read, ECC must be
employed. To improve the efficiency of memory space, it is recommended that the read failure due to single bit error should be
reclaimed by ECC without any block replacement. The block failure ratein the qualification report does not include those reclaimed
blocks.
Failure Mode
Detection and Countermeasure sequence
Write
Erase Failure
Status Read after Erase --> Block Replacement
Program Failure
Status Read after Program --> Block Replacement
Read
Single Bit Failure
Verify ECC -> ECC Correction
ECC
: Error Correcting Code --> Hamming Code etc.
Example) 1bit correction & 2bit detection
: If program operation results in an error, map out
the block including the page in error and copy the
*
target data to another block.
相關PDF資料 |
PDF描述 |
|---|---|
| KBE00S009M | 1Gb NAND x 2 + 256Mb Mobile SDRAM x 2 |
| KBE00S009M-D411 | 1Gb NAND x 2 + 256Mb Mobile SDRAM x 2 |
| KBJ2501 | 25A SINGLE PHASE SILICON BRIDGE RECTIFIER |
| KBJ2502 | 25A SINGLE PHASE SILICON BRIDGE RECTIFIER |
| KBJ2503 | 25A SINGLE PHASE SILICON BRIDGE RECTIFIER |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| KBE00S003M | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb NAND*2 + 256Mb Mobile SDRAM*2 |
| KBE00S003M-D411 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb NAND*2 + 256Mb Mobile SDRAM*2 |
| KBE00S009M | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb NAND x 2 + 256Mb Mobile SDRAM x 2 |
| KBE00S009M-D411 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb NAND x 2 + 256Mb Mobile SDRAM x 2 |
| KB-E100SRW | 功能描述:LED 顯示器和配件 Red 640nm 90mcd Diffused Light Bar RoHS:否 制造商:Avago Technologies 顯示器類型:7 Segment 數(shù)位數(shù)量:2 字符大小:7.8 mm x 14.22 mm 照明顏色:Red 波長:628 nm 共用管腳:Common Anode 工作電壓:2.05 V 工作電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 35 C 封裝:Tube |
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