參數(shù)資料
型號(hào)： KBE00G003M-D411
廠商： SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述： NAND 512Mb*2 + Mobile SDRAM 256Mb*2
中文描述： NAND閃存的512Mb * 2移動(dòng)SDRAM 256Mb的* 2
文件頁(yè)數(shù)： 67/89頁(yè)
文件大?。?/td> 1238K
代理商： KBE00G003M-D411
KBE00G003M-D411
MCP MEMORY
July 2005
67
Revision 0.1
12. About Burst Type Control
Basic
MODE
Sequential Counting
At MRS A
3
= "0". See the BURST SEQUENCE TABLE. (BL=4, 8)
BL=1, 2, 4, 8 and full page.
Interleave Counting
At MRS A
3
= "1". See the BURST SEQUENCE TABLE. (BL=4, 8)
BL=4, 8. At BL=1, 2 Interleave Counting = Sequential Counting.
Random
MODE
Random column Access
t
CCD
= 1 CLK
Every cycle Read/Write Command with random column address can realize Random
Column Access.
That is similar to Extended Data Out (EDO) Operation of conventional DRAM.
13. About Burst Length Control
Basic
MODE
1
At MRS A
2,1,0
= "000".
At auto precharge, t
RAS
should not be violated.
2
At MRS A
2,1,0
= "001".
At auto precharge, t
RAS
should not be violated.
4
At MRS A
2,1,0
= "010".
8
At MRS A
2,1,0
= "011".
Full Page
At MRS A
2,1,0
= "111".
Wrap around mode(infinite burst length) should be stopped by burst stop.
RAS interrupt or CAS interrupt.
Special
MODE
BRSW
At MRS A
9
= "1".
Read burst =1, 2, 4, 8, full page write Burst =1.
At auto precharge of write, t
RAS
should not be violated.
Random
MODE
Burst Stop
t
BDL
= 1, Valid DQ after burst stop is 1, 2 for CAS latency 2, 3 respectively
Using burst stop command, any burst length control is possible.
Interrupt
MODE
RAS Interrupt
(Interrupted by Precharge)
Before the end of burst, Row precharge command of the same bank stops read/write
burst with Row precharge.
t
RDL
= 2 with DQM, valid DQ after burst stop is 1, 2 for CAS latency 2, 3 respectively.
During read/write burst with auto precharge, RAS interrupt can not be issued.
CAS Interrupt
Before the end of burst, new read/write stops read/write burst and starts new
read/write burst.
During read/write burst with auto precharge, CAS interrupt can not be issued.
相關(guān)PDF資料
PDF描述
KBE00S009M 1Gb NAND x 2 + 256Mb Mobile SDRAM x 2
KBE00S009M-D411 1Gb NAND x 2 + 256Mb Mobile SDRAM x 2
KBJ2501 25A SINGLE PHASE SILICON BRIDGE RECTIFIER
KBJ2502 25A SINGLE PHASE SILICON BRIDGE RECTIFIER
KBJ2503 25A SINGLE PHASE SILICON BRIDGE RECTIFIER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KBE00S003M 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb NAND*2 + 256Mb Mobile SDRAM*2
KBE00S003M-D411 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb NAND*2 + 256Mb Mobile SDRAM*2
KBE00S009M 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb NAND x 2 + 256Mb Mobile SDRAM x 2
KBE00S009M-D411 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:1Gb NAND x 2 + 256Mb Mobile SDRAM x 2
KB-E100SRW 功能描述:LED 顯示器和配件 Red 640nm 90mcd Diffused Light Bar RoHS:否 制造商:Avago Technologies 顯示器類型:7 Segment 數(shù)位數(shù)量:2 字符大小:7.8 mm x 14.22 mm 照明顏色:Red 波長(zhǎng):628 nm 共用管腳:Common Anode 工作電壓:2.05 V 工作電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 35 C 封裝:Tube
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