參數(shù)資料
型號(hào): MAX1329BETL+
廠商: Maxim Integrated Products
文件頁數(shù): 69/78頁
文件大?。?/td> 0K
描述: IC DAS 12BIT 300KSPS 40-TQFN-EP
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 50
系列: *
MAX1329/MAX1330
12-/16-Bit DASs with ADC, DACs, DPIOs, APIOs,
Reference, Voltage Monitors, and Temp Sensor
______________________________________________________________________________________
71
Charge-Pump Component Selection
Optimize the charge-pump circuit for size, quiescent
current, and output ripple by properly selecting the
operating frequency and capacitors CDVDD, CFLY, and
CAVDD (Table 32). The charge pump is capable of pro-
viding a maximum of 25mA including what is used
internally. If less than 25mA is required, smaller capaci-
tor values can be utilized.
For lowest ripple, select 117kHz operation (CPDIV<1:0>
= 00 and OSCE = 1 when using the internal oscillator). In
addition, increasing CAVDD relative to CFLY further
reduces ripple. For highest efficiency, select 14.6kHz
operation (CPDIV<1:0> = 11 and OSCE = 1 when using
the internal oscillator) and select the largest practical
values for CAVDD and CFLY while maintaining at least a
30-to-1 ratio. For smallest size, select 117kHz operation.
See Table 32 for some suggested values and resulting
ripple for 25mA load current. See Figure 34 for load cur-
rent vs. flying capacitor value when optimizing for other
load currents.
Note that the capacitors must have low ESR to main-
tain low ripple. The CFLY flying capacitor ESR needs
to be < 0.1; and the CAVDD and CDVDD filter capaci-
tor ESR needs to be < 0.3. The CFLY flying capacitor
can easily be a ceramic capacitor; and the CAVDD and
CDVDD filter capacitor can be a low-ESR tantalum or
may need to be a combination of a small ceramic and a
larger tantalum capacitor.
When DVDD is lower than AVDD, the charge pump always
operates in voltage-doubler mode. It regulates the output
voltage using a pulse-width-modulation (PWM) scheme.
Using a PWM scheme ensures that the charge pump is
synchronous with the internal ADC preventing corruption
of the conversion results.
Operating the Analog Switches
The MAX1329/MAX1330 include two single-pole double-
throw (SPDT) and three single-pole single-throw (SPST)
analog switches. The two SPDT analog switches are
uncommitted and the three SPST analog switches are
connected between the DAC buffer or op amp outputs
and the inverting inputs.
The analog switches can be controlled using the Switch
Control register or any of the DPIOs. See the DPIO
Control and DPIO Setup registers to program the
DPIOs. The DPIOs should be used when direct control
is critical such as synchronizing with another event or if
the SPI bus bandwidth is not sufficient for the intended
application. The register bit for the analog switch is log-
ically OR’d with DPIOs enabled to control that switch.
The SPDT1 and SPDT2 analog switches can be operat-
ed as a SPDT or as a double-pole single-throw (DPST).
In the DPST mode, both switches can be opened or
closed together. This is useful when connecting two
external nodes to a common point. If a lower on-resis-
tance is required, NO_ and NC_ can be connected
together externally and be used as a SPST analog
switch with half the on-resistance.
The SPST analog switches are intended to be used to
set the DAC buffers and op amps to unity gain internal-
ly by software control. When the DAC buffers and op
amps are used as transimpedance amplifiers, the SPST
analog switches can be used to short the external tran-
simpedance resistor during high current periods to
keep the amplifier output in compliance.
CHARGE-PUMP
CLOCK (kHz)
ILOAD,
MAX
(mA)
CFLY
(F)
CAVDD
(F)
CDVDD
(F)
RIPPLE
(mV)
25
1.7
55.6
17.4
14.4
12.5
0.9
27.8
8.7
32
25
0.9
27.8
8.7
28.8
12.5
0.4
13.9
4.3
32
25
0.4
13.9
4.3
57.6
12.5
0.2
6.9
2.2
32
25
0.2
6.9
2.2
115.2
12.5
0.1
3.5
1.1
32
Table 32. External Component Selection
for 25mA Output Current and 2VDVDD -
VAVDD ≥ 0.4V (Figure 25)
CHARGE-PUMP LOAD CURRENT
vs. FLYING CAPACITOR VALUE
MAX1329
fig34
CFLY (F)
I LOAD
(mA)
4.5
4.0
3.0 3.5
1.0 1.5 2.0 2.5
0.5
5
10
15
20
25
30
35
40
45
50
0
05.0
fCP = 115.2kHz
fCP = 57.6kHz
fCP = 14.4kHz
fCP = 28.8kHz
Figure 34. Load Current vs. CFLY Value for 2VDVDD - VAVDD ≥ 0.4V
相關(guān)PDF資料
PDF描述
MAX13342EEBC+T IC TXRX USB FS 3WIRE 12-UCSP
MAX13410EESA+T IC TXRX RS-485 LDO/CTRL 8-SOIC
MAX1342BETX+ IC ADC/DAC 12BIT W/FIFO 36WQFN
MAX13431EEUB+T TXRX RS-485 16MBPS HALF 10MSOP
MAX13443EASA+T IC TXRX RS485 HALF DUPLEX 8-SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MAX1329BETL+ 功能描述:ADC / DAC多通道 12-Bit 2Ch 300ksps 5.4V Precision ADC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率: 分辨率:8 bit 接口類型:SPI 電壓參考: 電源電壓-最大:3.6 V 電源電壓-最小:2 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-40
MAX1329BETL+T 功能描述:ADC / DAC多通道 12-Bit 2Ch 300ksps 5.4V Precision ADC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率: 分辨率:8 bit 接口類型:SPI 電壓參考: 電源電壓-最大:3.6 V 電源電壓-最小:2 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-40
MAX132C/D 功能描述:模數(shù)轉(zhuǎn)換器 - ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
MAX132CNG 功能描述:模數(shù)轉(zhuǎn)換器 - ADC Integrated Circuits (ICs) RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
MAX132CNG+ 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 18-Bit .1ksps .545V Precision ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32