參數(shù)資料
型號: MPC603RFE133LC
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 133 MHz, RISC PROCESSOR, CQFP240
封裝: CERAMIC, QFP-240
文件頁數(shù): 1/2頁
文件大?。?/td> 500K
代理商: MPC603RFE133LC
The Motorola PowerPC 603e microprocessor (MPC603e) is a low-power implementation of the PowerPC
Reduced Instruction Set Computer (RISC) architecture. The PowerPC 603e microprocessor offers workstation-
level performance packed into a low-power, low-cost design ideal for desktop computers, notebooks and bat-
tery-powered systems, as well as printer and imaging equipment, telecommunications systems, networking and
communications infrastructure, industrial controls, and home entertainment and educational devices.
Industrial-grade, extended temperature PowerPC 603e microprocessors are available for harsh operating
environments. The PowerPC 603e microprocessor is software- and bus-compatible with the PowerPC 740,
PowerPC 750, and MPC7400 microprocessor families.
Superscalar Microprocessor
The PowerPC 603e microprocessor is a superscalar design
capable of issuing three instructions per clock cycle into five
independent execution units, including:
I
Integer unit
I
Load/Store unit
I
Floating-point unit
I
System register unit
I
Branch processing unit
The ability to execute multiple instructions in parallel, to
pipeline instructions, and the use of simple instructions with
rapid execution times yields maximum efficiency and throughput
for PowerPC 603e systems.
Product Highlights
The PowerPC 603e microprocessor features a low-power
2.5-volt or 3.3-volt design with three power-saving
modes—doze, nap and sleep. These user-programmable
modes progressively reduce the power drawn by the
processor. The PowerPC 603e microprocessor also uses
dynamic power management to selectively activate func-
tional units as they are needed by the executing instruc-
tions. Unused functional units enter a low-power state
automatically without affecting performance, software
execution, or external hardware.
PPC603EFACT/D
REV. 7
System Register
Unit
32b
Address
32b/64b
Data
MMU
Bus Interface Unit
System Bus
Integer
Unit
Floating Point
Unit
Inst. Cache
MMU
Data Cache
Load/Store
Unit
Instruction
Unit
Branch Processing
Unit
PowerPC 603e Microprocessor
Block Diagram
Fact Sheet
M OTOROLA P OWER PC 603e
M ICROPROCESSOR
Motorola PowerPC
603e Microprocessor
相關(guān)PDF資料
PDF描述
MPC603RRX100TC 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255
MPC603RFE100LC 32-BIT, 100 MHz, RISC PROCESSOR, CQFP240
MPC603RRX266RC 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255
MPC745BZT350LD 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255
MPC745BPX300RD 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC603RRX200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX200TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324