- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄359201 > MPXV2010G (飛思卡爾半導體(中國)有限公司) 10 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors PDF資料下載
參數(shù)資料
| 型號： | MPXV2010G |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | 10 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors |
| 中文描述： | 10千帕片上溫度補償 |
| 文件頁數(shù)： | 4/14頁 |
| 文件大?。?/td> | 361K |
| 代理商： | MPXV2010G |
MPX2010
Sensors
4
Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Figure 2. Output vs. Pressure Differential
Figure 2
shows the output characteristics of the MPX2010/
MPXV2010G series at 25
°
C. The output is directly
proportional to the differential pressure and is essentially a
straight line.
The effects of temperature on full scale span and offset are
very small and are shown under Operating Characteristics.
This performance over temperature is achieved by having
both the shear stress strain gauge and the thin-film resistor
circuitry on the same silicon diaphragm. Each chip is
dynamically laser trimmed for precise span and offset
calibration and temperature compensation.
Figure 3. Unibody Package: Cross Sectional Diagram (Not to Scale)
Figure 3
illustrates the differential/gauge die in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2010/MPXV2010G series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
Offset
(Typical)
O
kPa
PSI
2.5
0.362
5
0.725
7.5
1.09
10
1.45
Span
Range
(Typical)
V
S
= 10 Vdc
T
A
= 25
°
C
P1 > P2
30
25
20
15
10
5
0
–
5
TYP
a
MAX
MIN
Silicone
Die Coat
Die
P1
P2
Wire Bond
Lead Frame
RTV Die
Bond
Epoxy
Case
Stainless Steel
Metal Cover
相關PDF資料 |
PDF描述 |
|---|---|
| MPXV2053DP | 50kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors(50kPa片內(nèi)溫度補償和校準硅壓力傳感器) |
| MPXV2102DP | 100kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors(100kPa片內(nèi)溫度補償和校準硅壓力傳感器) |
| MPXV2202DP | 200kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors(200kPa片內(nèi)溫度補償和校準硅壓力傳感器) |
| MPXV4006G6U | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated(集成硅壓力傳感器，帶片內(nèi)信號調(diào)節(jié)、溫度補償和校準功能) |
| MPXV4115V | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPXV2010GP | 功能描述:板上安裝壓力/力傳感器 SOP TOP SIDE PORT RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準確性:+ / - 0.25 % 輸出類型:Digital 安裝風格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| MPXV2010GP | 制造商:Freescale Semiconductor 功能描述:Pressure Sensors IC |
| MPXV2050 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors |
| MPXV2050GP | 功能描述:板上安裝壓力/力傳感器 SOP TOP PORT RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準確性:+ / - 0.25 % 輸出類型:Digital 安裝風格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| MPXV2053DP | 功能描述:板上安裝壓力/力傳感器 SOP DUAL PORT RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準確性:+ / - 0.25 % 輸出類型:Digital 安裝風格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
發(fā)布緊急采購，3分鐘左右您將得到回復。