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參數(shù)資料
| 型號： | pentium III processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 bit Processor Mobile Module(32 位帶移動模塊處理器) |
| 中文描述： | 32位處理器的移動模塊（32位帶移動模塊處理器） |
| 文件頁數(shù)： | 7/67頁 |
| 文件大?。?/td> | 834K |
| 代理商： | PENTIUM III PROCESSOR |
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Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep
Technology
243356-005
Datasheet
1
1.0
Introduction
This document provides the technical specifications for integrating the Intel Pentium
III
processor
mobile module with Intel SpeedStep technology connector 2 (MMC-2) into the latest notebook
systems for today’s notebook market.
Building around this design gives the system manufacturer these advantages:
Avoids complexities associated with designing high-speed processor core logic boards.
A standard interface provides an upgrade path from previous Intel mobile modules.
1.1
References
Refer to the following documents for additional information relating to the Pentium
III
processor
mobile module with featuring Intel SpeedStep technology.
Mobile Pentium
III
Processor in BGA2 and Micro-PGA2 Packages Datasheet (Order
Number 245302)
Intel
440BX AGPSet: 82443BX Host Bridge/Controller Datasheet (Order Number: 290633-
001)
82371AB PCI-to-ISA/IDE Xcelerator (PIIX4) (Order Number: 290562-001)
Intel
82371MB (PIIX4E/M) Specification Update*
CK97 Clock Synthesizer/Driver Specification (OR-1089)
Intel
Pentium
III
Processor Mobile Module MMC-2 Simulation and Validation Kit Rev. 2.0
(OR-1781)
Intel
Pentium
III
Processor Mobile Module System Electronics 100-MHz Layout Guidelines
Rev. 1.0 (OR-1780)
Mobile Pentium
III
Processor/440BX AGPset Recommended Design and Debug Practices
(RDDP-A) 100 MHz Rev. 2.0 (SC-2760)
66/100MHz PC SDRAM Unbuffered SO-DIMM Specification Rev 1.0*
Intel
Mobile Module Design Guide (AP-590)
Pentium
II Processor Mobile Module MMC-2 Insertion & Extraction User Manual Rev 1.0*
Mobile Pentium
II Processor Mobile Module 400-Pin BGA Connector Assembly
Development Guide Rev. 1.0*
Focused Discussion on Intel
Mobile Modules Design for Mfg. & Best Methods for MHPG
Customers Rev. 1.0 (OR-1385)
EMI Design Guide (ORMD6-0859)
Intel
Mobile Module Newsletters*
Intel
Mobile Module Thermal Diode Temperature Sensor Application Note*
Geyserville Hardware Technical Specification, Revision 2.0 (OR-1728)
Geyserville Software Architecture Specification, Revision 1.5 (SC-2364)
Intel
MMC-2 Standoff/Receptacle Height Spreadsheet*
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