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參數(shù)資料
| 型號： | μPB1507GV |
| 廠商： | NEC Corp. |
| 英文描述： | 3.1 GHz input, High Division Silicon Prescaler ICs(3.0 GHz 定標(biāo)器) |
| 中文描述： | 3.1 GHz的投入，高司硅分頻器集成電路（3.0千兆赫定標(biāo)器） |
| 文件頁數(shù)： | 18/20頁 |
| 文件大?。?/td> | 143K |
| 代理商： | ΜPB1507GV |
18
P
PB1506GV,
P
PB1507GV
NOTE CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 10 000 pF) to the V
CC
pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
P
PB1506GV,
P
PB1507GV
Soldering method
Soldering conditions
Recommended condition symbol
Infrared ray reflow
Package peak temperature: 235
q
C,
Hour: within 30 s. (more than 210
q
C),
Time: 3 times, Limited days: no.
*
IR35-00-3
VPS
Package peak temperature: 215
q
C,
Hour: within 40 s. (more than 200
q
C),
Time: 3 times, Limited days: no.
*
VP15-00-3
Wave soldering
Soldering tub temperature: less than 260
q
C,
Hour: within 10 s.,
Time: 1 time, Limited days: no.
WS60-00-1
Pin part heating
Pin area temperature: less than 300
q
C,
Hour: within 3 s./pin,
Limited days: no.
*
*
It is the storage days after opening a dry pack, the storage conditions are 25
q
C, less than 65 % RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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