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參數(shù)資料
| 型號： | μPC3205GR |
| 廠商： | NEC Corp. |
| 英文描述： | IQ Demodulator For Digital Video/Data Receiver(應用于數(shù)字視頻/數(shù)據(jù)接收器的IQ 解調器) |
| 中文描述： | 智商解調器數(shù)字視頻/數(shù)據(jù)接收（應用于數(shù)字視頻/數(shù)據(jù)接收器的智商解調器） |
| 文件頁數(shù)： | 16/20頁 |
| 文件大?。?/td> | 135K |
| 代理商： | ΜPC3205GR |
Data Sheet P13541EJ3V0DS00
16
μ
PC3205GR
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesires oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) A low pass filter must be attached to V
cc
line.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit
Note
: None
VP15-00-3
Wave soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit
Note
: None
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
Note
After opening the dry pack, keep it in a place below 25 °C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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