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參數(shù)資料
| 型號： | μPC8109T |
| 廠商： | NEC Corp. |
| 英文描述： | 2.0 GHz Upconverter ICs FOR Cellular And Cordless Phone(用于蜂窩和無繩電話的2.0GHz 上變頻轉換器) |
| 中文描述： | 2.0 GHz的變頻器集成電路，移動電話和無繩電話（用于蜂窩和無繩電話的2.0GHz的上變頻轉換器） |
| 文件頁數(shù)： | 19/20頁 |
| 文件大?。?/td> | 215K |
| 代理商： | ΜPC8109T |
19
μ
PC8106T,
μ
PC8109T
NOTES ON CORRECT USE
(1) Observe precutions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor to the V
CC
pin.
(5) Connect a matching circuit to the RF output pin.
RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be satisfied when soldering this product.
Consult your NEC sales representative when using any other soldering process, or when soldering is done under
different conditions.
μ
PC8106T,
μ
PC8109T
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25
°
C and maximum relative humidity of 65%
Caution Do not apply more than a single process at once, except for “Partial heating method”.
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Peak package surface temperature: 235
°
C
Reflow time
Number of reflow processes
Exposure limit
Note
: 30 seconds or less (at 210
°
C or more)
: 3
: None
Peak package surface temperature: 215
°
C
Reflow time
Number of reflow processes
Exposure limit
Note
: 40 seconds or less (at 200
°
C or more)
: 3
: None
Solder temperature
Flow time
Number of flow processes
Exposure limit
Note
: 260
°
C
: 10 seconds or less
: 1
: None
Solder temperature
Flow time
Exposure limit
Note
: 300
°
C or less
: 3 seconds or less
: None
IR35-00-3
VP15-00-3
WS60-00-1
SOLDERING PROCESS
SOLDERING CONDITIONS
SYMBOL
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