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參數(shù)資料
| 型號(hào)： | μPD30200 |
| 廠商： | NEC Corp. |
| 英文描述： | High-Performance, 64-Bit RISC Microprosessor(高性能64位RISC微處理器) |
| 中文描述： | 高性能64位RISC Microprosessor（高性能64位的RISC微處理器） |
| 文件頁(yè)數(shù)： | 20/24頁(yè) |
| 文件大?。?/td> | 170K |
| 代理商： | ΜPD30200 |
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μ
PD30200, 30210
20
Data Sheet U10116EJ6V0DS00
4. RECOMMENDED SOLDERING CONDITIONS
The products should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC representa-
tive.
Table 4-1. Surface Mounting Type Soldering Conditions
μ
PD30200GD-80-LBB:
μ
PD30200GD-100-MBB: 120-pin plastic QFP (28
×
28 mm)
μ
PD30200GD-133-MBB: 120-pin plastic QFP (28
×
28 mm)
μ
PD30210GD-
×××
-MBB: 120-pin plastic QFP (28
×
28 mm)
120-pin plastic QFP (28
×
28 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less, Exposure limit: 7 days
Note
(after that, prebake at 125
°
C for 36 hours.)
IR35-367-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max, (at 200
°
C or higher),
Count: Two times or less, Exposure limit: 7 days
Note
(after that, prebake at 125
°
C for 36 hours.)
VP15-367-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max.,
Count: Once, Preheating temperature: 120
°
C max. (package surface
temperature), Exposure limit: 7 days
Note
(after that, prebake at 125
°
C for 36 hours)
WS60-367-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
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