參數(shù)資料
型號(hào)： μPD30710
廠商： NEC Corp.
英文描述： 64-Bit Microprocessor(64位RISC微處理器)
中文描述： 64位微處理器（64位的RISC微處理器）
文件頁(yè)數(shù)： 29/36頁(yè)
文件大?。?/td> 210K
代理商： ΜPD30710
μ
PD30500, 30500A, 30500B
29
Data Sheet U12031EJ4V0DS00
4. RECOMMENDED SOLDERING CONDITIONS
Soldering this product under the following soldering conditions is recommended.
For the details of the recommended soldering conditions, refer to Information Document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For the soldering methods and recommended other than those recommended, consult NEC.
(1) Soldering Conditions of Surface Mount Type
μ
PD30500S2-150:
μ
PD30500S2-180:
μ
PD30500S2-200:
μ
PD30500AS2-250:
μ
PD30500BS2-300
Note 1
: 272-pin plastic BGA (C/D advanced type) (29
×
29)
272-pin plastic BGA (C/D advanced type) (29
×
29)
272-pin plastic BGA (C/D advanced type) (29
×
29)
272-pin plastic BGA (C/D advanced type) (29
×
29)
272-pin plastic BGA (C/D advanced type) (29
×
29)
Soldering Method
Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec max. (210
°
C min.),
Number of times: 3 times max., Number of days: 3
Note 2
(after that, prebaking is
necessary at 125
°
C for 10 hours)
IR35-103-3
VPS
Package peak temperature: 215
°
C, Time: 25 to 40 sec max. (200
°
C min.),
Number of times: 3 times max., Number of days: 3
Note 2
(after that, prebaking is
necessary at 125
°
C for 10 hours)
VP15-103-3
Partial heating
Pin temperature: 300
°
C max., Time: 3 sec max. (per device side)
—
Notes 1.
Under development
2.
Number of days in storage after the dry pack has been opened. The storage conditions are at 25
°
C, 65% RH
MAX.
Caution Do not use two or more soldering methods in combination (except partial heating).
(2) Soldering Conditions of Insertion Type
μ
PD30500RJ-150: 223-pin ceramic PGA (48
×
48)
μ
PD30500RJ-180: 223-pin ceramic PGA (48
×
48)
μ
PD30500RJ-200: 223-pin ceramic PGA (48
×
48)
Soldering Method
Soldering Conditions
Wave soldering
(Pin only)
Solder bath temperature: 260
°
C max., Time: 10 sec max.
Partial heating
Pin temperature: 300
°
C max., Time: 3 sec max. (per pin)
Caution Wave soldering is only for the lead part in order that jet solder cannot contact with the chip directly.
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