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參數(shù)資料
| 型號(hào)： | μPD70P3000 |
| 廠商： | NEC Corp. |
| 英文描述： | 16/32 Bit Single Chip Microcontrollers(16/32位單片微控制器) |
| 中文描述： | 16/32位單片機(jī)微控制器（16/32位單片微控制器） |
| 文件頁(yè)數(shù)： | 67/72頁(yè) |
| 文件大?。?/td> | 334K |
| 代理商： | ΜPD70P3000 |
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μ
PD70P3000
67
9. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the folllowing recommended conditions.
For the details of the recommended soldering conditions, refer to Information Document
“Semiconductor
Device Mounting Technology Manual” (C10535E)
.
For soldering methods and soldering conditions other than those recommended, consult NEC.
Table 9-1. Soldering Conditions of Surface Mount Type
Soldering Method
Soldering Condition
Symbol of
Recommended Condition
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
(210
°
C min.), Number of times: 2 max., Number of days: 7
Note
(after that, prebaking is necessary at 125
°
C for 10 hours)
<Precaution>
Products other than those supplied in thermal-resistant tray (magazine,
taping, and non-thermal-resistant tray) cannot be baked in their packs.
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (200
°
C min.),
Number of times: 2 max., Number of days: 7
Note
(after that, prebaking is
necessary at 125
°
C for 10 hours)
<Precaution>
Products other than those supplied in thermal-resistant tray (magazine,
taping, and non-thermal-resistant tray) cannot be baked in their packs.
VP15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds (per side of device)
–
Note
The number of days during which the product can be stored at 25
°
C, 65 % RH max. after the dry pack
has been opened.
Caution
Do not use two or more soldering methods in combination (except partial heating).
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