參數(shù)資料
型號(hào): μPD72044F
廠商: NEC Corp.
元件分類: 8位微控制器
英文描述: 8 Bit Single Chip Microcontrollers
中文描述: 8位單片機(jī)微控制器
文件頁數(shù): 64/72頁
文件大?。?/td> 547K
代理商: ΜPD72044F
m
PD78042F, 78043F, 78044F, 78045F
64
H
13. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
m
PD78042F,
m
PD78043F,
m
PD78044F, or
m
PD78045F.
For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting
Technology Manual(C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 13-1 Soldering Conditions for Surface-Mount Devices
m
PD78042FGF-
m
PD78043FGF-
m
PD78044FGF-
m
PD78045FGF-
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-3B9: 80-pin plastic QFP (14
20 mm)
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-3B9: 80-pin plastic QFP (14
20 mm)
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-3B9: 80-pin plastic QFP (14
20 mm)
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-3B9: 80-pin plastic QFP (14
20 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering process
Soldering conditions
Recommended conditions
Infrared ray reflow
Peak package's surface temperature: 235 °C
Reflow time: 30 seconds or less (210 °C or more)
Maximum allowable number of reflow processes: 3
IR35-00-3
VPS
Peak package's surface temperature: 215 °C
Reflow time: 40 seconds or less (200 °C or more)
Maximum allowable number of reflow processes: 3
VP15-00-3
Wave soldering
Solder temperature: 260 °C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
WS60-00-1
: 120 °C max.
(measured on the package surface)
Partial heating method
Terminal temperature: 300 °C or less
Heat time: 3 seconds or less (for one side of a device)
相關(guān)PDF資料
PDF描述
μPD72045F 8 Bit Single Chip Microcontrollers
μPD750004 4 Bit Single Chip Microcontrollers(4位單片微控制器)
μPD750004(A) 4 Bit Single Chip Microcontrollers(4位單片微控制器)
μPD750006 4 Bit Single Chip Microcontrollers(4位單片微控制器)
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